Texas Instruments Corporation

Richard Thorne

Floyd F Schemmel

An apparatus and method for automatically detecting defects on silicon dies on silicon wafers comprising a silicon wafer acquisition system () and a computer () connected to said silicon wafer image acquisition system (), wherein said computer () automatically aligns a silicon wafer (), calibrates the image acquisition system (), analyzes die images by determining a statistical die model from a plurality of dies, and compares the statistical die model to silicon die images to determine if the silicon dies have surface defects, is disclosed.

Apparatus and method for automatically detecting defects on silicon dies on silicon wafers

An apparatus and method for automatically detecting defects on silicon dies on silicon wafers comprising a silicon wafer acquisition system ( ) and a computer ( ) connected to said silicon wafer image acquisition system ( ), wherein said computer ( ) automatically aligns a silicon wafer ( ), calibrates the image acquisition system ( ), analyzes die images by determining a statistical die model from a plurality of dies, and compares the statistical die model to silicon die images to determine if the silicon dies have surface defects, is disclosed.

An apparatus and method for detecting defects on silicon dies on a silicon wafer (,) comprising an image acquisition system (,) and a computer (,) that determines a statistical die model by analyzing a random selection of dies (,) within a die matrix (,) and compares the statistical die model to matrices of silicon dies (,) to determine which silicon dies (,) have surface defects, is disclosed.

Apparatus for detecting defective integrated circuit dies in wafer form

An apparatus and method for detecting defects on silicon dies on a silicon wafer (16) comprising an image acquisition system (10) and a computer (32) that determines a statistical die model by analyzing a random selection of dies (42) within a die matrix (37) and compares the statistical die model to matrices of silicon dies (38) to determine which silicon dies (38) have surface defects, is disclosed.

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Sherman, TX, United States of America

Richard Thorne