National Center for Manufacturing Sciences

Richard Thomas Grannells

Daniel A Scola

A high-performance printed wiring board assembly is disclosed which utilizes a substrate component having a reinforcement material. The substrate has a glass fabric reinforcement embedded in a condensation-reacted and thermally-crosslinked nadic end-capped polyimide resin. There are electrically conductive lamina current pathways directly adhered to the substrate. There are high-temperature soldered or metallurgically bonded connections that electrically join conductor leads of electrical devices to the lamina current pathways.

Printed wiring board assembly with a substrate having a glass fabric reinforced, condensation reacted and thermally crosslinked nadic end-capped polyimide resin

A method of manufacturing a high-performance printed wiring board assembly, and the resulting product, utilize a substrate component that has a reinforcement material embedded in a condensation-reacted and thermally-crosslinked nadic end-capped polyimide resin electrically conductive lamina component pathways directly adhered to the substrate component resin and high-temperature soldered or otherwise attached connections that electrically join the conductor leads of included electrical devices to the lamina component conductive pathways.

Growing community of inventors

Southwick, MA, United States of America

Richard Thomas Grannells