Xanoptix Inc.

Ciena Corporation

Richard Stack

Roger Dugas

John A Trezza

Keith Kang

Mark Czoschke

Thomas S Faska

Charles A Kaplan

The present invention relates to a data distribution device comprising of a core electronics suite having at least two data ports where each port is in communication with its own network transport medium. At least two broadband transceivers, each in communication with its own broadband data port, enable sending and receiving of broadband data signals. At least two converters, each in communication with its own transceiver, enable the conversion of RF modulated data signals into data packets and the conversion of data packets into RF modulated data signals. The device includes a data switch, in communications with at least two converters and at least two broadband transceivers, for inspecting and routing data packets between data ports; a processor in communication with the data switch that controls the sending and receiving of data packets between at least two converters; and an exterior housing that is sealed and environmentally hardened to allow the data switch, the processor, and the converters with their transceivers, to operate in an outdoor environment.

Outdoor hardened exo-modular and multi-phy switch

An optical device has a mating piece constructed to accept and mate with a commercially available optical connector, an optical module, and a spacer located between the mating piece and the optical module, the spacer maintaining the mating piece and the optical module in alignment relative to each other in at least the Z direction and one other direction.

Method for relaxing mechanical tolerance in an opto-electronic unit

A method of packaging an optical chip or an optical chip with an electronic chip that allows for close connections between the two chips. The method reduces parasitic capacitance and inductance, and provides unobstructed optical access while allowing for connection of a heat sink to the electronic chip for cooling.

Optical chip packaging via through hole

Communication module

Growing community of inventors

Amherst, NH, United States of America

Richard Stack