Henkel Kommanditgesellschaft Auf Aktien

Henkel Ag & Company, Kgaa

Henkel Kommanditgesellschaft Auf Aktien (henkel Kgaa)

Produktionstechnik Industrieservice Borst

Richard Scholta

Gunter Hoffmann

Ralf Grauel

Ralf Eberhardt

Volker Kels

Thomas Moeller

Dirk Kasper

Willi Borst

Katja Strauss

Roland Heume

Joerg Hurdelbrink

Jorg Hurdelbrink

Jörg Hurdelbrink

The invention relates to a hotmelt adhesive based on at least one ethylene and/or propylene/Cto C&#x3b1;-olefin copolymer obtainable by metallocene-catalysed polymerization, on at least one tackifying resin, and on at least 0.1% to 15% by weight of a copolymer or terpolymer based on Cto Colefins with (meth)acrylic esters of low molecular mass alkanols, the copolymer containing COOH groups or anhydride groups, and also, if desired, on wax and additives, and to its use for bonding finished substrate surfaces.

Hotmelt adhesive with improved adhesion

Hot-melt adhesives containing at least one aromatic modified polyethylene and/or polypropylene (co)polymer, a further ethylene or propylene/C4 to C20 alpha-olefin copolymer, and at least one tackifying resin are useful for the adhesive bonding of package and paperboard products.

Hot-melt adhesive

The present invention pertains to an arrangement for the controlled application of adhesive to substrate. In at least one embodiment, the arrangement comprises a) an adhesive reservoir, b) a pump, c) an applicator head having at least one applicator nozzle, d) a volume throughput sensor, and e) a monitoring unit. The reservoir, the pump, and the applicator head are connected together by a conduit system carrying the adhesive. The volume throughput sensor and the monitoring unit are connected together by a pulse transmission line. The monitoring unit, the feed pump, and the applicator head are connected together by control lines. In at least one embodiment, the application of adhesive to substrates is controlled by measuring the volume throughput of the adhesive, transmitting signals indicative of volume throughout to the monitoring unit, and controlling the amount of adhesive applied to the substrate material in-line in response to the signals.

Device and method for regulating application of adhesives and/or sealants

Growing community of inventors

Kö'ln, Germany

Richard Scholta