Osram Opto Semiconductors Gmbh

Osram Gmbh

Osram Oledgmbh

Richard Scheicher

Marc Philippens

Moritz Engl

Angela Eberhardt

Ivar Tangring

Florian Peskoller

Thomas Reeswinkel

Sergey Kudaev

Peter Vogt

Martin Mueller

Karl-Heinz Hohaus

Andreas Lovich

Ansgar Fischer

Robert Gareis

Thomas Huettmayer

Johannes Krijne

Erwin Eiling

Wolfgang Goergen

In an embodiment an optoelectronic component includes a first joining partner including an LED chip with a structured light-emitting surface and a compensation layer applied to the light-emitting surface, wherein the compensation layer has a surface facing away from the light-emitting surface and spaced apart from the light-emitting surface, and wherein the surface forms a first connecting surface, a second joining partner having a second connecting surface, the first and second connecting surfaces being arranged such that they face each other and a bonding layer made of a film of low-melting glass having a layer thickness of not more than 1 μm, wherein the bonding layer bonds the first and second connecting surfaces together, wherein the structure of the light-emitting surface is embedded in the compensation layer, and wherein the first and second connecting surfaces are smooth such that their surface roughness, expressed as center-line roughness, is less than or equal to 50 nm.

Optoelectronic component with a transparent bond between two joining partners and method of manufacturing the same

An optoelectronic device includes at least one optoelectronic semiconductor chip that emits radiation, at least one metallic reflecting surface, at least one functional component having a component surface different from the metallic reflecting surface, and a barrier layer stack for protection against corrosive gases arranged both on the at least one metallic reflecting surface and the component surface, wherein the barrier layer stack includes at least one inorganic oxide, oxynitride or nitride layer and at least one plasma-polymerized siloxane layer.

Optoelectronic device and method of producing an optoelectronic device

A conversion device includes a carrier body, a conversion body, which is secured on the carrier body, for converting electromagnetic radiation, a conduction track, which is applied on the conversion body, for monitoring the conversion body, and a contact element applied on the carrier body. The contact element has a first layer construction including at least a first contact layer and a second contact layer including mutually different materials. The conduction track has a second layer construction including at least a first conduction layer and a second conduction layer comprising mutually different materials. The contact element is electrically connected to the conduction track. At least one of the first conduction layer or the second conduction layer are electrically conductive and the thickness of said conductive layers is chosen such that an electrical impedance of the conduction track lies in a predetermined range.

Conversion device with stacked conductor structure

An arrangement () for holding a substrate () in a material deposition apparatus, which substrate () has a deposition side () upon which material (M) is to be deposited, and which arrangement () comprises: a shadow mask () comprising a number of deposition openings (Di); a support structure () comprising a number of surround openings (Si); and a support structure holding means () for holding the support mask () and/or a substrate holding means () for holding the substrate (), such that the support structure () is on the same side as the deposition side () of the substrate (), and the shadow mask () is positioned between the substrate () and the support structure () such that at least one deposition opening (Di) of the shadow mask () lies within a corresponding surround opening (Si) of the support structure ().

Arrangement for holding a substrate in a material deposition apparatus

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Thierhaupten, Germany

Richard Scheicher