Other

Silicon Valley Group, Inc.

Asml Holding N.v.

Aviza Technology Limited

Asml Us, Inc.

Richard Savage

Emir Gurer

Ed C Lee

Bruce E Mayer

Dan Lester Cossentine

Frank S Menagh

Helder R Carvalheira

Philip A Troiani

Eric R Vaughan

Herbert E Litvak

An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.

Plasma deposition of spin chucks to reduce contamination of Silicon wafers

A semiconductor wafer processing system including a multi-chamber module having vertically-stacked semiconductor wafer process chambers and a loadlock chamber dedicated to each semiconductor wafer process chamber. Each process chamber includes a chuck for holding a wafer during wafer processing. The multi-chamber modules may be oriented in a linear array. The system further includes an apparatus having a dual-wafer single-axis transfer arm including a monolithic arm pivotally mounted within said loadlock chamber about a single pivot axis. The apparatus is adapted to carry two wafers, one unprocessed and one processed, simultaneously between the loadlock chamber and the process chamber. A method utilizing the disclosed system is also provided.

Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system

Plasma deposition of spin chucks to reduce contamination of silicon wafers

Method and apparatus for adaptive process control of critical dimensions during spin coating process

An apparatus for spin coating surfaces with liquid polymer comprises a spin coating chamber having a rotatable chuck for supporting an object to be coated. A distributor introduces gases into the chamber. A solvent vapor and carrier gas supply provides a carrier gas having a controlled level of solvent vapor therein within the range of from 0 to saturation concentrations of solvent vapor. A solvent vapor sensor is positioned with respect to the coating chamber to produce signals which correspond to the concentration of solvent vapor in the coating chamber. A control means is connected to the solvent vapor concentration sensor and to the solvent vapor and carrier gas supply means for controlling the level of solvent concentration in the carrier gas supplied by the solvent vapor and carrier gas supply means. The solvent vapor level can be obtained by controlled mixing of solvent-bearing and solvent-free gas streams, or by injection of solvent into a gas stream by means of an atomizer, for example. The solvent vapor concentration sensor includes a component positioned for exposure to solvent vapor and which has a property which changes as a function of the solvent vapor concentration to which it is exposed. A preferred sensor can include a membrane, the vibrational frequency of which changes as a function of the solvent vapor concentration to which it is exposed; a surface, an electrical property of which changes as a function of the solvent vapor concentration to which it is exposed; a sensor which detects an acoustical property which changes as a function of the solvent vapor concentration to which it is exposed; or an optical detector which detects an optical property which changes as a function of the solvent vapor concentration to which it is exposed.

Photoresist coating process control with solvent vapor sensor

A pet feeding device having a pedal portion which when depressed by the pet causes a lid unit to swing open to uncover a food receptable, incorporating an improved simplified linkage which minimizes the effort required to operate the pedal.

Pet feeding device

Growing community of inventors

Scotts Valley, CA, United States of America

Richard Savage