Hall Labs LLC

Richard Rea

Marshall Soares

David R Hall

Derek Maxwell

A heat and shock resistant integrated circuit (IC) of the present invention includes a base material, a metal layer disposed on the base material, a silicon die disposed on the metal layer, additive material disposed on the base material, gas filled filler material disposed between the additive material and the silicon die, and first traces electrically connecting the silicon die to the additive material. Packing of the integrated circuit provides exceptional thermal stress relief and impact protection of circuitry within the packaging.

Heat resistant and shock resistant integrated circuit

A current-mode, multi-stage oscillator converts an oscillating current to an oscillating voltage using one or more current voltage converters on one or more of the output stages of the multi-stage oscillator. The use of current voltage convertors transforms the low output swing (e.g., transistor threshold limited) of the oscillator into a rail-to-rail voltage oscillation with minimal jitter and operational stability over a wide temperature range.

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Lehi, UT, United States of America

Richard Rea