E.i. Dupont De Nemours and Company

Richard R Draudt

Jay Robert Dorfman

Thomas D Lantzer

Arthur Harvey Mones

David L Sutton

The invention is directed to a method for rapidly forming a dense pattern of via holes in multilayer electronic circuits in which via holes in the dielectric layers are formed by drilling with an excimer laser under controlled operating conditions.

Method for forming via holes in multilayer circuits

A multi-plate lamination fixture includes at least a first, an intermediate and a bottom plate, of which the intermediate and either the bottom or the top plate each have a keyway therein adjacent one surface thereof and in which the intermediate and the other of the bottom or the top plate have a key projecting past the other surface thereof thereby to permit registered stackability of the plates. The intermediate and either the bottom or the top plate each also have a recess extending into one surface thereof for at least a predetermined distance, while the intermediate and the other of the bottom or the top plate have a pin projecting past the other surface thereof. The projecting pins are received in the recess of the adjacent plates to further assure accurate location of the stacked plates forming the lamination fixture.

Growing community of inventors

Pittsboro, NC, United States of America

Richard R Draudt