Boston Scientific Scimed, Inc.

The Charles Stark Draper Laboratory, Inc.

Coherent, Inc.

Polaroid Corporation

Polaroid-corporation-patent Department

The Charles Stark Draper Lab., Inc.

Richard P Tumminelli

Jeffrey Zerfas

Farhad Hakimi

John R Haavisto

Paul Jortberg

Elias Snitzer

Moungi G Bawendi

Christopher L Oskin

David W Robertson

Hong Po

Jessica Hixon

Thomas F Marinis

Robert P Dahlgren

Robert J Mansfield

Paul Van Broekhoven

Bill C McCollum

Jerome B Sohn

Carl Donadio

Jeffrey W Zerfas

An apparatus includes an optical fiber extending from a proximal end to a distal end. The optical fiber may include a cladding layer circumferentially disposed about a core layer and a substantially spherically shaped portion at the distal end. The apparatus may also include a first coating circumferentially disposed on a first length of the cladding layer, and a second coating circumferentially disposed on a second length of the cladding layer. The second length may extend distally from a region proximate the distal end of the first coating.

Methods and apparatus related to a distal end portion of an optical fiber having a substantially spherical shape

In one embodiment, an apparatus includes an optical fiber made of a silica-based material. A proximal end portion of the optical fiber has an outer-layer portion. The proximal end portion can be included in at least a portion of a launch connector configured to receive electromagnetic radiation. The apparatus also includes a component that has a bore therethrough and can be made of a doped silica material. The bore can have an inner-layer portion heat-fused to the outer-layer portion of the optical fiber. The component can also have an index of refraction lower than an index of refraction associated with the outer-layer portion of the optical fiber.

Methods and apparatus related to a launch connector portion of a ureteroscope laser-energy-delivery device

In one embodiment, an apparatus may include an optical fiber that may have a surface non-normal to a longitudinal axis of a distal end portion of the optical fiber. The surface may define a portion of an interface configured to redirect electromagnetic radiation propagated from within the optical fiber and incident on the interface to a direction offset from the longitudinal axis. The apparatus may also include a doped silica cap that may be fused to the optical fiber such that the surface of the optical fiber may be disposed within a cavity defined by the doped silica cap.

Methods and apparatus related to a side-fire member having a doped silica component

In one embodiment, an apparatus may include a first capillary component. A second capillary component may be disposed outside of the first capillary component and may have an inner surface, wherein a portion of the inner surface may be heat-fused to an outer surface of the first capillary component. The apparatus may also include a portion of an optical fiber disposed inside of the first capillary component and the portion of the optical fiber can have an outer surface. A portion of the outer surface of the optical fiber may be heat-fused to an inner surface of the first capillary component. The optical fiber may have a distal surface configured to reflect electromagnetic radiation propagated along a longitudinal axis of a distal end portion of the optical fiber in a lateral direction through the inner surface of the first capillary component and the inner surface of the second capillary component.

Methods and apparatus related to a distal end of a side-fire optical fiber having multiple capillary components

Method and apparatus related to a side-fire member having a doped silica component

A micromechanical sensor is fabricated on a semiconductor wafer, and a control circuit is fabricated on another semiconductor wafer. A cavity is etched on the back side of the control circuit wafer, the cavity being formed such that the sensor on the other wafer fits within the cavity when the wafers are brought together in an adjoining relationship. Through-holes are etched through the back side of the control circuit wafer to allow access to electrical contact points, and a patterned layer of metal is deposited to form electrical interconnections between the electrical contact points and termination points on the back side of the wafer via the through-holes. The termination points are arranged such that electrical contacts of the sensor contact the termination points when the wafers are placed in the adjoining relationship. The wafers are then cleaned and bonded together in the adjoining relationship. In a typical process the wafers contain multiple sensors and control circuits, respectively, and thus the bonded wafers are diced to yield individual bonded sensor-circuit pairs. The bonded pairs are then packaged in an integrated-circuit package such as a leadless chip carrier in a known manner.

Integrated packaging of micromechanical sensors and associated control circuits

A method of decapsulating a packaged die includes removing packaging material from the bottom section of a die-containing package to expose a die pan, removing the die pan, removing material between the die pan and the bottom surface of the die, using the bottom surface of the die to determine a grind plane substantially parallel to the top surface of the die, and removing packaging material from the top section of the die-containing package to form a top surface substantially planar to the grind plane, preferably intersecting the wire bonds on the face of the die.

Method of recovering encapsulated die

A slab waveguide pumped channel waveguide laser includes a slab waveguide having a primary pump guiding layer with a first index of refraction and having first and second opposing faces and a peripheral edge including a mirrored surface, and cladding means having a second index of refraction lower than the first index of refraction, proximate the first and second opposing faces; at least one rare earth doped channel waveguide laser having a third index of refraction higher than the first index of refraction disposed in the primary guiding layer; and means for introducing pumping energy into the guiding layer to reflect between the mirror surfaces and energize the laser.

Slab waveguide pumped channel waveguide laser

A quantum dot laser includes a laser host material; a plurality of quantum dots disposed in the host material; and a pumping source for exciting and inducing a population inversion in the quantum dots.

Quantum dot Laser

A method of forming an optical channel waveguide by gettering includes forming on a substrate a porous waveguide layer containing an index of refraction raising dopant in a compound; sealing a portion of the waveguide layer along a path; and reacting the component, including the index of refraction raising dopant, with a reactant in the unsealed portion of the waveguide layer to form a volatile product from the reactant and dopant to deplete the dopant in the unsealed portion of the waveguide layer and reduce its index of refraction relative to that in the path to produce a channel waveguide along the path.

Method of forming an optical channel waveguide by gettering

A method of forming an optical channel waveguide includes forming on a substrate a waveguide layer of silica doped with an index of refraction raising dopant whose concentration profile in a first dimension includes a higher concentration region and an adjacent lower concentration region; and heating the waveguide layer along two spaced areas defined in the second and third dimension which define a path between them for diffusing the dopant along the first dimension from the higher concentration region to the lower concentration region to reduce the index of refraction of the higher concentration region in portions of the higher concentration region proximate the spaced areas and create a waveguide along the path.

Growing community of inventors

Ashland, MA, United States of America

Richard P Tumminelli