International Business Machines Corporation

Richard P Snider

Levi A Campbell

Eric James McKeever

Michael J Ellsworth, Jr

John G Torok

Robert K Mullady

Donald W Porter

Amilcar R Arvelo

Roger R Schmidt

Milnes P David

Dustin W Demetriou

John J Loparco

Francis R Krug, Jr

Xiaojin Wei

Allan C VanDeventer

Christopher R Ciraulo

A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks. First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.

Flexible coolant manifold&#x2014;heat sink assembly

Apparatuses and methods are provided for preventing removal of an air-moving assembly from a chassis when in operating state. The apparatus includes an interlock assembly having a slide element and one or more interlock elements. The slide element is slideably coupled to the air-moving assembly and resides in a first position when the air-moving assembly is in the operating state, and is slidable to a second position when the air-moving assembly is in a quiesced state. The slide element prevents removal of the air-moving assembly from the chassis in the first position, and allows removal of the air-moving assembly from the chassis in the second position. The interlock element(s) is associated with the slide element and prevents sliding of the slide element from the first position to the second position when the air-moving assembly is in the operating state.

Interlock assembly for air-moving assembly

Flexible coolant manifold-heat sink assembly

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The cooling apparatus further includes a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.

Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s)

Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided, which include providing a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The method further includes providing a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and providing a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.

Methods of fabricating a coolant-cooled electronic assembly

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system. The coolant-cooled structure includes: one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).

Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s)

Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided which include: coupling a thermal transfer structure configured to one or more sides of an electronics card having one or more electronic components to be cooled, the thermal transfer structure including a thermal spreader coupled to the one side of the electronics card; and disposing a coolant-cooled structure adjacent to the socket of the electronic system, the coolant-cooled structure including one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket, and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).

Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s)

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New Paltz, NY, United States of America

Richard P Snider