At+t Corp.

Western Electric Company, Inc.

Richard P Debiec

Michael D Evans

Warren J Pendergast

William T Wydra

A multilayer composite interconnection for use in circuits including thin film elements and electrical interconnections includes a copper barrier layer interposed between a nickel layer and a gold layer of the interconnection. The copper layer is in a thickness sufficient to bar or at least to restrict diffusion of nickel through the gold layer under processing and operating conditions. The interconnection multilayer composite interconnection includes in an ascending order, titanium, palladium or palladium-titanium alloy, copper, nickel, copper barrier and gold layers.

Film circuit metal system for use with bumped IC packages

Through the use of a uniquely constructed molybdenum frame, a completely additive fabrication method may advantageously be employed to form an array of minute interconnecting circuit crossovers directly on the frame, using photolithographic and plating processes, with the requisite arches of the crossovers being directly formed within specially configured grooves of the frame during the plating operation. The frame is thereafter initially used as a temporary crossover carrier member, and subsequently as a bonding member during the thermo-compression bonding of the individual crossovers to respectively associated bond sites of the circuit, which typically may be of the integrated thin or thick film type. Such a simplified additive crossover generating technique advantageously obviates the need of not only potentially circuit-damaging chemical etching operations, but the many associated processing and handling steps associated therewith.

Growing community of inventors

LaGrange Park, IL, United States of America

Richard P Debiec