General Electric Company

Rca Inc.

Richard N Brown

Lawrence K White

Robert J Corsmeier

Franco N Sechi

Phillip Czeslaw Jozwiak

Srinivas T Rao

James C Whartenby

Raymond J Menna

Saligrama N Subbarao

Phillip C Jozwiak

Scott A Bennett

Virgil L Lawson

A microwave substrate is formed by thermocompression bonding a metalization system layer to two substrates having corresponding properties. One of the properties in one material is significantly different in value than that property in the other material. The substrates are selected from polycrystalline and monocrystalline ceramic materials. The bonded slabs are sliced and ground planes attached to form finished composite substrates.

Electronic circuit substrate construction

An improved electron beam resist structure comprises an organic planarizing layer which has been treated with an ion beam for a time sufficient to render it conductive and an electron beam resist layer thereover. The electron beam resist layer is preferably oxygen plasma resistant. When the resist layer is not resistant to oxygen plasma and it is desired to develop the planarizing layer by oxygen plasma, the structure additionally includes a thin hard mask layer, suitably of silicon dioxide, interposed between the conductive planarizing layer and the resist layer.

Treatment of planarizing layer in multilayer electron beam resist

A capacitor comprises a pair of electrodes with an insulator between the electrodes. The insulator has a primary dielectric with at least one void. A fill dielectric is in the void to improve yield. A method of making a capacitor comprises forming a first electrode, forming a primary dielectric having a void over the electrode, forming a fill dielectric in the void, and forming a second electrode over the dielectrics.

Capacitor and method for making same with high yield

A method is disclosed for forming a continuous glass coating which is free of pinholes, cracks, and the like over the surface of an electrical device. In the method disclosed, a mixture consisting essentially of an organic vehicle which is reactive with a suitable plasma to form gaseous reaction products at a temperature below the thermal decomposition temperature of the organic vehicle and a glass frit having a glass transition temperature above the thermal degradation temperature is applied in a layer over the surface of a completed electrical device. The applied layer of the mixture is then subjected to a suitable plasma at a temperature below the thermal degradation temperature of the organic vehicle for a time sufficient to remove the organic vehicle from the layer. The layer is then heated to or above the glass transition temperature of the glass frit until the glass frit fuses and forms a continuous defect-free glass coating over the surface of the electrical device.

Method of forming a continuous glass coating over the surface of an

An electronic circuit including a substrate with an aperture therethrough is manufactured by cutting one or more slots in an edge of a slab of substrate, metalizing the slotted edge of the substrate and metalizing a mating edge of a mating substrate, securing together the metalized edges of the slotted substrate and mating substrate to create an aperture through the substrate from an upper surface to a lower surface thereof and creating a printed circuit pattern on one of the upper and lower surfaces of the combined substrate and metalizing the other surface of the combined substrate including a connection to the metalized edges.

Method of fabricating an electronic circuit including an aperture

A method is provided for fabricating a via connector from a first surface of a semiconductor wafer to an opposite second surface of the wafer. The first step consists of forming an adherent metal layer on the first surface on the semiconductor wafer. If the first surface of the semiconductor wafer has electronic components formed thereon, the metal layer is applied over the electronic components and preferably a protective layer of material is formed over the metal layer. Via holes are then laser drilled at predetermined locations through the metal layer and then through the semiconductor wafer. Thereafter a photoresist layer is applied over the first surface and exposed and developed to provide passage holes in the photoresist which are in alignment with the laser drilled apertures. The metal layer is then connected in the cathode position of the electroforming apparatus and via connectors are thereafter electroformed in the via holes.

Method for fabricating via connectors through semiconductor wafers

A method of precisely controlling the thickness of dielectric islands on a substrate is provided. The subject method comprises forming a patterned layer of an etchable metal over a first dielectric layer on a substrate, forming a second layer of dielectric material thereover so that there is contact where the etchable metal layer has been removed, patterning the second dielectric layer so that islands remain only over the openings in the etchable layer, removing the etchable metal layer and then patterning the first dielectric layer. There are thus provided islands of dielectric material on the substrate having a thickness equal to the first only or the first and second dielectric layers together, respectively. The process may be extended to form at least one additional layer of dielectric material on certain of the islands.

Composition and thickness variation in dielectric layers

A cooking appliance wherein a unique U-shaped bracket is provided for connecting an outer housing, an inner cooking vessel, a thermostat assembly and a bottom cover to each other. One of the arms of the bracket is inserted through a downwardly extending tab of the cooking vessel, the other arm of the bracket is connected to a screw for mounting a stack thermostat, and the central portion of the bracket is connected to a screw for urging the vessel downwardly and the bottom cover upwardly to economically hold the parts in assembled position on the outer insulated housing.

Cooking appliance

A rotating member such as a turbine disk is provided with an axially extending retaining means such as a ring having a plurality of D-shaped, open-ended slots formed about an edge thereof. A collar embracing a generally radially extending tube is received within each contoured slot and a pair of laterally extending lips formed upon each collar receive and engage the ring therebetween, thereby limiting radial movement of the collar. A circumferentially extending groove about the inner circumference of the ring intersects each groove and receives a split locking ring to limit axial movement of the collars and tubes.

Apparatus for attaching tubing to a rotating disk

A coffeemaker having a ground coffee basket and a heated brewing water spreader positioned generally above the ground coffee basket wherein the spreader includes a generally vertical cylindrical dam wall extending upwardly from a generally flat foraminous wall for permitting brewing water to flow over the dam wall, through an overflow passage and into the ground coffee basket when the spreader has been filled with heated brewing water above the upper surface of the dam wall.

Coffeemaker with brewing water spreader

A handle assembly for a glass carafe wherein a metal band is positioned around the neck of the carafe and a plastic handle is connected to the metal band. A unique plastic block is provided with two generally parallel slots for receiving the ends of the metal band for temporarily holding the band on the carafe while the handle is being secured to the block and the band.

Handle assembly

A coffeemaker having a ground coffee basket, a brewing water spreader positioned on top of the ground coffee basket and a brewed coffee container positioned below the basket wherein a unique brew control cap is positioned on the spreader for controlling the amount of heated brewing water that is permitted to flow to the coffee grounds within the basket or is diverted through a by-pass passage to the brewed coffee container without extracting coffee from the ground coffee. A plurality of spaced openings are formed in a wall of the cap for selective registry with one, two or more spaced openings that are formed in a wall of the spreader so that movement of the wall of the cap with respect to the spreader will uncover one, two or more of the openings to permit more or less heated water to flow to ground coffee within the basket to thereby regulate the strength of the brewed coffee within the coffee container that is positioned below the coffee basket.

Coffeemaker with brew strength control

A measuring dispenser wherein a generally cylindrical drum having a transverse wall is positioned at the bottom of a canister, and a longitudinally movable partition with a transverse wall is inserted within the drum so that variable volume measuring chambers are provided by longitudinally moving the partition within the cylindrical drum.

Measuring dispenser

An electric drip coffeemaker wherein a dry ground coffee dispenser is supported at an upper overhanging portion of a housing, a carafe is positioned on a lower stand portion of the housing at one side of the dispenser, and a ground coffee basket is selectively positionable on guideways which are provided at the lower portion of the dispenser and at the top wall of the housing above the carafe.

Growing community of inventors

Macungie, PA, United States of America

Richard N Brown