Lucent Technologies Inc.

At+t Corp.

Avaya Technology LLC

Richard Michael Flynn

John N Abel

Fred W Verdi

Mark B Clifton

Daniel Lee Stephenson

Paul Francis Kolesar

The cable enclosure assembly of the present invention includes a cable enclosure base, a faceplate mount, a removable full-width bezel and a cover. The cable enclosure base attaches to a wall at a location where an optical fiber cable protrudes through the wall. The cable fiber passes through a cable enclosure base cutout formed in the cable enclosure base. Next, a faceplate is attached to the faceplate mount. The faceplate mount is then attached to the cable enclosure base via a pivot-and-mount configuration. The removable full-width bezel can be connected with the cable enclosure base at two positions, thereby enabling the positioning of the bezel within the cable enclosure base to be adjusted. Lastly, the cover is removably secured to the cable enclosure base.

Cable enclosure assembly

A distribution module for use in a traditional electrical panel that provides coupling functionality for optical and electrical connectors. The distribution module is comprised of a housing with a passage defined therein. The distribution module further includes high density, modular coupling strips, which are chosen based on the type of connectors to be coupled. These coupling strips are joined together and then secured in the passage formed in the housing. Once assembled, the distribution module is received into an opening in the panel thereby integrating both optical and electrical couplers in a single panel.

Distribution module for optical couplings

A high density optical fiber coupling strip has two buildout members, each of which has a mating surface. Each mating surface has formed thereon a footprint that is identical for each member, so that the mating surface, when abutted together mesh with each other in proper alignment, thereby aligning the members, and can then be joined by welding or similar means. Regardless of the connector type to be received by each member, the footprints insures that the members will be properly mated, thus making possible hybrid coupling strips as well as unitary strips.

High density coupling module

Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.

Smart cards having thin die

Improved methods for fabricating smart cards are disclosed. Semiconductor die approximately 0.004 to 0.007 inches thick are fabricated using chemical stress relief processes and UV dicing tape. The die are positioned substantially on the neutral axis of a smart card, thereby providing smart cards having improved resistance to mechanical flexure.

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Noblesville, IN, United States of America

Richard Michael Flynn