Dell Products Inc.

Mts IP Holdings Ltd

Richard Mark Eiland

Chris Everett Peterson

Hasnain Shabbir

Paul Allen Waters

Eric Michael Tunks

Eduardo Escamilla

Robert Boyd Curtis

Douglas Evan Messick

Tyler B Duncan

Ayedin Nikazm

Jimil Shah

Jyh-Yinn Lin

Muhammad B Ahmed

Ethan Schmitz

Luke Gregory

Dominick Adam Lovicott

Richard William Guzman

Brandon Joel Brocklesby

Hung-Pin Chien

Evangelos Koutsavdis

Alaric Joaquim Narcissius Silveira

Ioannis Manousakis

Jonathan Brown

Chien-Hung Chou

Jianlin Zheng

Tsung-Ping Chen

Bilal Ahmed

Juan Torres-Gonzalez

Juan Torres-gonzalez

A computing device includes a printed circuit board, a base, and a heater apparatus. The printed circuit board is secured to the base. The heater apparatus includes a heater component and a plurality of heater wires, and the heater component is disposed between the printed circuit board and the base.

Heater apparatus for a computing device

An information handling system may calculate multiple temperature changes within the information handling system. Each of the temperature changes is across a different bank of components of the information handling system. The system may calculate multiple inlet temperatures, each of which is associated with a different component of the information handling system. The inlet temperatures are utilized in determining whether cooling requirements for the system configuration are met. Based on the temperature changes and the inlet velocities, the system may determine whether the cooling requirements are met. In response to the cooling requirements for the system configuration not being met, the system may decrease a current cooling fan speed for the information handling system. In response to the cooling requirements for the system configuration being met, the system may store the current cooling fan speed.

Calculate minimum required cooling fan speeds

An information handling system may include a motherboard, an information handling resource, a heat spreader thermally coupled to the information handling resource, and a load plate mechanically coupled to the motherboard in order to maintain electrical and mechanical coupling of the information handling resource to the motherboard. The load plate may include a body at least partially overlapping with and mechanically coupled to the heat spreader when the load plate is mechanically coupled to the motherboard, an opening formed within the body and configured to expose the heat spreader through the opening when the load plate is mechanically coupled to the motherboard, and an angled feature formed at one edge of a perimeter of the opening and decreasing in depth from the opening to the body.

Processor load plate for two-phase liquid immersion cooling

A system may include an information handling resource, a liquid cooling system for providing cooling of the information handling resource, a management controller for providing out-of-band management of the system, and a flow-rate sensor coupled to the liquid cooling system and configured to measure a volume of flow of fluid through a fluidic channel of the liquid cooling system per unit time and communicate one or more signals to the management controller indicative of the volume of the flow of the fluid through the fluidic channel of the liquid cooling system per unit time.

Systems and methods for flow rate detection in a liquid cooling system

Cooling assemblies and related methods to cool a plurality of semiconductor dies mounted to a printed circuit board are described. A valved boiling enhancement enclosure located adjacent to a heat spreader that thermally couples to one or more semiconductor dies. The boiling enhancement enclosure can actively manage boiling of coolant liquid near the heat spreader in a two-phase immersion-cooling chamber to make the temperatures across the semiconductor dies more uniform.

Boiler enhancement coatings with active boiling management

A method may include receiving power information from an information handling resource regarding an amount of electrical power consumed by the information handling resource, receiving first temperature information from a first temperature sensor regarding a first temperature, receiving second temperature information from the second temperature sensor regarding a second temperature, and based on the power information, the first temperature information, and the second temperature information, estimating a fluid flow rate of the liquid coolant through the liquid cooling system.

Systems and methods for estimating flow rate in a liquid cooling system

An information handling system may include a backplane configured to couple at a first side thereof to a plurality of physical storage resources, an air mover configured to provide cooling to the information handling system, and a shelf coupled to the backplane at a second, opposite side thereof, wherein the shelf is disposed between the first side of the backplane and the air mover. The shelf may include an acoustically absorbent material.

Direct-mount acoustics damping shelf at backplane-identified devices

Methods and systems for thermal management are disclosed. The thermal management method and systems may reduce the likelihood of a data processing system exceeding thermal limits even in cases of highly customizable and modifiable data processing system. To reduce the likelihood of the data processing system failing to meet thermal limits, the data processing system may implement a distributed thermal management system. The distributed thermal management system may include multiple components that are responsible for granular and/or global thermal management of the data processing system.

System and method for thermal management of multi-enclosure system

Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.

Direct to chip application of boiling enhancement coating

Embodiments may be directed to a codesigned shroud for a chassis comprising a plurality of components and a plurality of fans generating a plurality of airflows to cool the plurality of components. The codesigned shroud may have a plurality of walls defining a plurality of channels, wherein at least two walls of the plurality of walls define each channel of the plurality of channels. Each channel may be aligned with a direction of an airflow of the plurality of airflows. At least one channel includes a set of baffles oriented substantially perpendicular to the direction of an airflow in the channel. Each baffle may be formed with acoustically absorbent material to absorb acoustic energy that could affect performance of a component, wherein a first baffle of the set of baffles is offset from a second baffle of the set of baffles.

Codesigned air shroud

A computing device includes a bezel and an enclosure. The bezel includes an air circulation component and a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat an internal volume of the enclosure.

Heater apparatus and air circulation component-integrated bezel for a computing device

A computing device includes a bezel and an enclosure. The bezel includes a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat at least a volume of air entering the enclosure.

Heater apparatus-integrated bezel for a computing device

Disclosed herein are systems and methods that may be implemented in real time to determine the total volumetric rate of airflow through a chassis enclosure of an information handling system platform directly from real time measured cooling fan power consumption in combination with standalone or system-level cooling fan power characteristics (e.g., expressed as cooling fan power curves) that relate cooling fan volumetric airflow rate to cooling fan power consumption at the current fan rotation speed. This determined value of total real time volumetric airflow rate may then be used, for example, by individual system level thermal control algorithms and/or data center level thermal control algorithms.

Systems and methods to determine system airflow using fan characteristic curves

A number of slots in a chassis of an information handling system and a number of a plurality of sleds to be housed in the chassis may be determined. An airflow for each of the plurality of sleds in each of the plurality of placement configurations may be determined based, at least in part, on the number of slots in the chassis and the number of the plurality of sleds to be housed in the chassis. A recommended placement for each of the sleds may be determined based at least in part on the airflow for each of the plurality of sleds for the plurality of placement configurations. A notification may be generated comprising the recommended placements for each of the plurality of sleds.

Chassis layout monitoring and analysis to enhance temperature management

An information handling system includes a chassis having multiples sleds and an embedded controller. The embedded controller retrieves relative impedances for all of the sleds, and calculates a maximum available airflow for the first sled based the relative impedances of all other sleds. A baseboard management controller (BMC) of a first sled requests a boot operation for the first sled. The BMC collects configuration information for the first sled, and determines an airflow impedance of the first sled based on the configuration information. The BMC provides the airflow impedance and a power allocation request to the embedded controller. The BMC compares the maximum available airflow to a minimum airflow requirement for the first sled. If the maximum available airflow is less than the minimum airflow requirement, the BMC implements power limits for processors in the first sled to prevent overheating of components within the first sled.

Growing community of inventors

Austin, TX, United States of America

Richard Mark Eiland