Flir Systems, Incorporated

Richard M Goeden

Gary B Hughes

Pierre M Boulanger

Barbara Sharp

Joseph Kostrzewa

Michael Kent

Russell D Granneman

Paul Schweikert

Andrew Sharpe

Gregory A Carlson

Alex Matson

Nuwan Nagahawatte

Neil Cutcliffe

Scott Vilander

George Speake

Bob Zahuta

Ted Takagi

Robert Ernst

John Graff

Neela Nalam

Stephen Lyon

Tim Martin

Ted Hoelter

Jeffrey S Scott

Ronald W Berry

Marco A Scussat

Richard G Lane

Robert W Dennis

An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

Wafer level packaging of microbolometer vacuum package assemblies

A boresight alignment system facilitates aligning a plurality of cameras and/or images of the cameras with respect to one another. The system may have a mount configured to facilitate attachment of a bezel containing a plurality of cameras to the mount. The system may have a plurality of targets and each target may be configured to provide light of at least two different wavelengths and/or ranges of wavelengths. One or more baffles may be disposed optically between the mount and the target assembly to inhibit stray light from being incident upon the cameras.

Boresight alignment station

Systems and methods directed to calibration techniques for infrared cameras are disclosed for some embodiments. For example, a method of determining infrared sensor calibration information, in accordance with an embodiment, includes performing a calibration operation on an infrared sensor to obtain calibration information, wherein the infrared sensor is not within an infrared camera core, and storing the calibration information.

Sensor calibration systems and methods for infrared cameras

Systems and methods directed to calibration techniques for infrared cameras are disclosed. For example, a method of obtaining calibration information for an infrared device includes providing a calibration target adapted to provide a low-emissivity scene; performing a calibration operation on the infrared device to obtain the calibration information; and storing the calibration information.

Calibration systems and methods for infrared cameras

A motorized leveling stage capable of adjusting the angular position of a work piece relative to a reference plane includes an upper stage, a lower stage, and a hinge coupling corresponding edges of the two stages together for relative pivotal movement of the stages. A first spring pivotally biases the upper and lower stages toward each other about the axis of the hinge. A slide is disposed for sliding movement on an upper surface of the lower stage in a direction generally perpendicular to the hinge axis. The slide includes an upper surface defining an inclined plane disposed in sliding abutment with a lower surface of the upper stage such that movement of the slide toward and away from the hinge respectively raises and lowers the upper stage relative to the lower stage. A motorized drive assembly is operable to control movement of the slide relative to the hinge.

Motorized leveling stages

Growing community of inventors

Goleta, CA, United States of America

Richard M Goeden