Henkel Research Corporation

Richard M Chan

Ta Yen Ching

Ta-Wang Lai

Curing agents for epoxy resins composed of (a) the reaction product of a co-reactant comprising either an epichlorohydrin (co) polymer or a (co)polymer of a chlorovinyl acetate, chloroalkyl acrylate with an organic amino compound containing at least one active hydrogen and having a pK.sub.B value within the range of from about 7 to about 9, preferably imidazole and substituted imidazoles; (b) an N-fatty imidazole and (a); (c) an N-fatty imidazole and an elastomeric polymer are disclosed. The curing agents are essentially water insoluble and give rise to epoxy resins which may be cured at relatively low temperatures below about 100.degree. C. The epoxy resins are suitable for use as adhesives, coatings and in composite applications.

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Fremont, CA, United States of America

Richard M Chan