The Boeing Company

Richard Louis Singleton

Ketao Liu

Brian C Thompson

Christopher Andre Mouton

Gregory L Mayhew

Edward C Limberg

Gustavo V Catipon

Christopher J Epple

Ching-Ping Lo

A system and method for SpaceWire network management are disclosed involving a network and a network manager (NM). The network includes a plurality of switches and a plurality of nodes. The switches and nodes do not have any preprogrammed knowledge of the network topology and/or of their unit identification (UID) code. In one or more embodiments, the network is a spacecraft communications network. In at least one embodiment, the method for managing the SpaceWire network comprises the network manager (NM) determining link connectivity of the network; verifying the switches are properly configured to allow for logical address routing; and verifying the nodes are configured to process, receive, and transmit data through the network. In some embodiments, the method further comprises determining newly added units, removed units, and/or unresponsive units in the network, and propagating this information through an active unit table.

SpaceWire network management

An integrated circuit assembly includes a base board, an interposer, and an array of solder balls electrically and structurally interconnecting the interposer and the base board. The interposer has a backbone layer having a backbone stiffness, a first compliant layer affixed to the backbone layer between the backbone layer and the integrated circuit and having a first-layer stiffness of less than the backbone stiffness, and a second compliant layer affixed to the backbone layer between the backbone layer and the base board and having a second-layer stiffness of less than the backbone stiffness. An integrated circuit is supported on the interposer. The integrated circuit includes integrated-circuit bonding pads thereon and a bonding pad protective coating overlying the integrated-circuit bonding pads. An electrical interconnect extends from the integrated circuit to at least one of the solder balls, and a cover overlies and protects the integrated circuit.

Integrated circuit assembly having interposer with a compliant layer

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Redondo Beach, CA, United States of America

Richard Louis Singleton