Motorola Corporation

Richard Lee Mangold

Christopher Lee Becher

Ovidiu Neiconi

Douglas W Hendricks

Reed A George

Richard K Brooks

Eric Joseph Faragi

Reed Allen George

John Patrick Hunt

Christopher John Keane

Frank Joseph Juskey

A solder printing apparatus (40) for use within a solder printer (34) includes a vision and alignment mechanism (44), a steering mechanism (46), a vacuum conveyer (48), and a tension roller assembly (42). The vision and alignment mechanism (44) controls the position of the flexible tape (10) and sends a signal to the steering mechanism (46). The steering mechanism (46) adjusts the position of the flexible tape (10) in response to receiving the signal from the vision and alignment mechanism (44). The vacuum conveyer (48) holds and advances the flexible tape (10). The tension roller assembly (42) maintains tension in the flexible tape (10).

Solder printing apparatus

An assembly (,) includes a front housing (,), a back housing (,), an electrical component (,) having a plurality of component conductive pads (,), a substrate (,) having a plurality of substrate conductive pads (,), a flex circuit (,) having a first plurality of flex conductive pads (,) and a second plurality of flex conductive pads (,), and a connector (,). The connector (,) is situated between the flex circuit (,) and the electrical component (,) for connecting the second plurality of flex conductive pads (,) to the plurality of component conductive pads (,). The first plurality of flex conductive pads (,) and the plurality of substrate conductive pads (,) are in alignment, and the connector (,) also compresses the assembly (,) to create an electrical connection between the first plurality of flex conductive pads (,) and the plurality of substrate conductive pads (,).

Assembly with dual purpose connector

An apparatus (400) used for indexing and affixing components to a substrate includes a vacuum conveyor and a controller (816) for controlling operation of the apparatus (400). The conveyor includes pallets (102), first and second tracks (414, 416), first and second motors (502, 503), a vacuum source, a plenum (110), and first and second elevators (404, 405). The pallets carry the substrate, while the first and second tracks guide the pallets. The first motor is used for driving a pallet in a first direction on the first track, while the second motor is used for driving a pallet in a direction opposite to the first direction on the second track. The plenum is coupled to the vacuum source and at least one pallet for applying adhering forces to the substrate. The first and second elevators are used for transferring a pallet between the first and second tracks.

Apparatus for indexing and affixing components to a substrate

A method for selectively marking integrated circuit chips (205, 210) formed on a wafer (200) includes the steps of testing the integrated circuit chips (205, 210)) of the wafer (200) to determine whether the integrated circuit chips (205, 210) are functional, dispensing underfill material (215) only on functional integrated circuit chips (205), and separating, subsequent to the dispensing step, the wafer (200) into individual integrated circuit chips (205, 210). The functional integrated circuit chips (205) are marked with the underfill material (215), while nonfunctional integrated circuit chips (210) are not marked with the underfill material (215).

Method for marking functional integrated circuit chips with underfill

An apparatus (400) enclosing a portion of a substrate (401) is used for affixing at least one component to a corresponding circuit of the substrate when a manufacturing line (800) ceases to operate. The apparatus includes a conveyor (400), heating elements (102), and a controller (816) for controlling operation of the apparatus (400). The conveyor is used for indexing the substrate periodically through the apparatus. The heating elements are used for dividing the portion of the substrate enclosed by the apparatus into controllable temperature zones (902). The controller is adapted to cause each of the plurality of heating elements to dynamically adjust the temperature of each of the controllable temperature zones upon the indexing process of the manufacturing line (800) ceasing to operate, until at least one component of each circuit enclosed by the apparatus has been adequately affixed to its corresponding circuit.

Method and apparatus for affixing components to a substrate when a

An electronic device (100) comprises a circuit carrying substrate (300) having an electronic circuit pattern (301) formed thereon, at least one component (302) having leads (304) for electrically coupling the at least one component (302) to the electronic circuit pattern (301) formed on the circuit carrying substrate (300), and a thermoplastic coating (200, 200') for covering the leads (304) of the at least one component (302) to insulate the leads (304) thereof.

Solid phase conformal coating suitable for use with electronic devices

According to the present invention, a screen printer (200) selectively applies solder paste to multiple types of printed circuit boards. The screen printer (200) includes mobile placement equipment (210), which receives and transports the boards, and application equipment, which includes first and second stencils (225), frames for holding the stencils (225) in fixed positions, and an applicator (415) for applying solder paste to a board through either the first or second stencil (225). A controller (215) determines the type of a board received by the mobile placement equipment (210), then, when the board is of a first type, directs the mobile placement equipment (210) to a location aligned with the first stencil. When the board is of a second type, the mobile placement equipment (210) is directed to a location aligned with the second stencil.

Apparatus for selectively applying solder paste to multiple types of

A single screen printer (200) holds at least two solder stencils (225). The screen printer (200) receives a printed circuit board (105) and determines a printed circuit board configuration. When the printed circuit board (105) is of a first configuration, the printed circuit board (105) is aligned with a first stencil (225) and solder paste is selectively applied to the printed circuit board (105) through the first stencil (225). When the printed circuit board (105) is of a second configuration, the printed circuit board is aligned with a second stencil (225) through which solder paste is selectively applied to the printed circuit board (105).

Method and apparatus for selectively applying solder paste to multiple

A method and apparatus for underencapsulating a component (502) on a substrate (402). The method robotically places an underencapsulant film (406) on at least one surface of a first surface of the component (502) and a second surface of a substrate (402), the first and second surfaces substantially opposing each other when the component (502) is placed on the substrate (402). Next, the method places the component (502) on the substrate (402) to dispose the underencapsulant film (406) between the first and second surfaces. The method then bonds (1006,1008 or 1006,1010) the component (502) to the substrate (402) with the underencapsulant (406).

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Lake Worth, FL, United States of America

Richard Lee Mangold