International Business Machines Corporation

Richard Lee Carlson

George G Zamora

Bruce Dale King

Alex Irwin Panasiuk

Rudolph Manuel Lopez

A method of thermal compression bonding conductors of a multiconductor flat cable or electrical component by melting through a base layer from the reverse side of a base layer supporting the conductors. The multiconductor flat cable or electrical component comprises a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site. The conductors fan out from the IC chip to connections at the outer perimeter, and the top cover is eliminated completely.

Direct thermal compression bonding through a multiconductor base layer

A bonding opening exposing conductors through a cover of a multiconductor flat cable or electrical component to allow direct bonding thereof is described. The multiconductor flat cable or electrical component having a base layer with conductors disposed thereon and a flat cover having an opening provided therein at a bonding site, preferably by die cutting. The flat cover with the opening is laminated to the base layer, overlaying the conductors, so that the conductors are mechanically stabilized by the base layer while being exposed through the bonding opening. The shape of the multiconductor flat cable or electrical component of the present invention may be highly varied. In one embodiment, the flat multiconductor electrical component circumferentially extends around a central area, for example, totally encompassing in IC chip which may be connected to the conductors thereof at a bonding site. The conductors fan out from the IC chip to connections at the outer perimeter, and the top cover is eliminated completely.

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Ben Lomond, CA, United States of America

Richard Lee Carlson