US Government As Represented by the Secretary of the Army

United States of America As Represented by the Secretary of the Air Force

K Systems Corporation

Richard Lc Wu

Leon Moy

Viral Panchal

Daniel Lee Prillaman

James Grassi

Sandra J Fries-Carr

Jason Wasserman

Peter Bletzinger

Jesse Sunderland

Peter B Kosel

Patrick Mark

William C Lanter

Kevin Mulligan

There is provided a mold apparatus and process whereby a warhead body can be fabricated in a single over molding process which may also include therein metal fragments, metal balls, obturators, boat tails and other aerodynamic features, metal rings and/or threads. Other molds and processes are presented whereby a warhead body may be over molded in a polymer matrix in sequential steps which may include adding therein metal balls, then fragments, and any of obturators, boat tails and other aerodynamic features, metal rings and/or threads, as desired. Still another process for fabricating a warhead body is presented whereby an insert section is first preloaded with metal fragments and covered with a skin, then the insert section is inserted into an oversized area in a mold, and polymer is then loaded around the insert section to form a unitary warhead body.

Method for sequentially fabricating a cartridge casebody through injection molding

A new method for ion beam deposition of diamond-like carbon coatings onto a variety of substrates is described. A high power, radio frequency excited-inductively coupled ion gun directs a beam of carbon and hydrogen ions at a substrate inside an ultra vacuum deposition chamber. A four axis scanner is used for coating large and nonplaner substrates. A quadrupole mass spectrometer is mounted inside the deposition chamber for real time monitoring of ion composition. The disclosed method is particularly effective for coating zinc sulfide and zinc selenide infrared windows.

Process for large area deposition of diamond-like carbon films

One aspect of the present invention is directed to a capacitor. The capacitor includes a first layer and a second layer. The first layer includes a first electrically conductive substrate having a first surface and a second surface. A first dielectric film is deposited on the first surface of the first substrate and a second dielectric film is deposited on the second surface of the first substrate. The second layer contacts the first layer. The second layer includes a second electrically conductive substrate having a first surface and a second surface. A third dielectric film is deposited on the first surface of the second substrate, and a fourth dielectric film is deposited on the second surface of the second substrate.

Capacitor structures with dielectric coated conductive substrates

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Beavercreek, OH, United States of America

Richard Lc Wu