The Boc Group, Inc.

Richard L Newcomb

Peter A Sieck

Stephen C Schulz

Terry A Trumbly

Hans Peter Theodorus Ceelen

An arrangement of magnets and stacks of magnets has been developed for use in magnetron sputtering devices. The arrangement may include commercially available or easily manufactured magnets. The arrangement may also include magnetic shunts to tune the magnetic field. The arrangements may be potted to provide protection from the environment, and may be incorporated into a system for cooling the magnets and target. When used in a magnetron sputtering device, the arrangement provides a magnetic field that results in nearly uniform sputtering over most of the target area. Further, the magnet arrangement provides target utilization values that are significantly higher than those provided by prior art magnet systems. Thus, the present invention also provides a method of arranging magnets for optimal performance and a method for improving target utilization.

High target utilization magnet array and associated methods

In one group of embodiments, two or more small anodes are spaced apart from one another in a magnetron, with some aspect of their electrical power being individually controlled in a manner to control a density profile across a plasma. In another group of embodiments, the same effect is obtained by mechanically moving one or more small anodes or anode masks. When used in a magnetron having either a rotating cylindrical cathode or a stationary planar cathode and designed to sputter films of material onto a substrate, the uniformity of the rate of deposition across the substrate is improved. Also, adverse effects of sputtering dielectric materials are reduced.

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Rio Vista, CA, United States of America

Richard L Newcomb