Jds Uniphase Corporation

Lumentum Operations LLC

Richard L Duesterberg

Jay A Skidmore

Lei Xu

Prasad Yalamanchili

Marc K Von Gunten

Jihua Du

James Yonghong Guo

Xiangdong Qiu

Kuochou Tai

Michael Y Au

Edmund L Wolak

Reddy Raju

Nicolas Guerin

Jeffrey P Zack

Nina D Morozova

Donald C Hargreaves

Yan Xiao

Hilary Clarke

Christopher L Hart

William Bardy

Laura Zavala

Fiber burning and/or overheating of the fiber feedthrough in high-power laser modules, which may cause catastrophic and/or collateral damage, may be addressed by providing an optical fiber assembly designed to withstand overheating due to errant high power laser light that is directed toward the input core of a fiber but may be at least partially misaligned. The optical fiber may be secured within a mount having a passageway such that the end face of the optical fiber extends past an opening of the passageway to a focal plane of the incident light. The end of the optical fiber may include a section that has a reduced or absent cladding layer (e.g., etched to form a tapered cladding region) so as to reduce the amount of light captured by the cladding and/or to leak the light out quickly.

High power misalignment-tolerant fiber assembly

A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Light emitting semiconductor device

A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Semiconductor device assembly

The invention relates to sources of optical radiation wherein polarized radiation from first and second rows of light emitters is first collimated and combined into two combined beam using first and second rows of collimating and beam re-directing elements, respectively, and then polarization multiplexed to form a polarization-multiplexed output beam. In order to reduce the footprint, emitters of the first and second emitter rows are disposed in an interleaved, staggered arrangement, and the second row of collimating and beam re-directing elements is disposed in a space between the first emitter row and the first row of collimating and beam re-directing elements.

Beam combining light source

The present invention relates to a component assembly and to a method of fabricating such a component assembly. The component assembly includes a substrate, a mount attached to the substrate, and a component attached to the mount with solder by melting the solder with light from a light source. The mount is composed of a ceramic material having properties advantageous for soldering using a light source. As a first property, the ceramic material is optically absorptive to enable the mount to be heated by the light from the light source. As a second property, the ceramic material has a first thermal conductivity at an operating temperature of the component and a second thermal conductivity at a melting point of the solder, the second thermal conductivity being at least 25% lower than the first thermal conductivity.

Component assembly and fabrication method

The invention provides a fiber pigtail assembly wherein a polarization maintaining fiber is soldered directly to a mounting pad without a sleeve or a ferrule therebetween. A portion of the polarization maintaining fiber near a fiber end is embedded in a vertical slow axis orientation within an asymmetrical solder ball having a flat portion for adhering to the mounting pad. The vertical slow axis orientation of the polarization maintaining fiber within the solder ball enhances power stability and polarization extinction ratio properties of optical modules utilizing the invention.

Polarization maintaining fiber pigtail assembly

A fiber tail assembly (FTA) with a micro-lens formed in the fiber tip is used to couple the laser light out of the package and along the fiber. The FTA is soldered at two points where metallized bands are deposited on the fiber pigtail, one at a fiber mount near the diode where it can be soldered into alignment with the laser diode, and two at the snout which forms a feed through the housing and seal for the package. Typically, the FTA is metallized along its entire length within the package. In this invention the two-metallized bands are separated by a region that is unmetallized.

Optical fiber pigtail assembly

Growing community of inventors

Mountain View, CA, United States of America

Richard L Duesterberg