Greatbatch Ltd.

Greatbatch-sierra, Inc

Maxwell Energy Products, Inc.

Other

Richard L Brendel

Robert A Stevenson

Christine A Frysz

Jason Woods

Warren S Dabney

Thomas Marzano

Keith W Seitz

John E Roberts

Dominick J Frustaci

William C Thiebolt

Christopher Michael Williams

Xiaohong Tang

Buehl E Truex

Haytham Hussein

Robert Shawn Johnson

Steven W Winn

Holly Noelle Moschiano

Donald K Haskell

Scott Knappen

Scott Brainard

Robert Naugler

Ryan Allan Stevenson

Haitong Zeng

Jose Luis Lorente-Adame

Henry R Halperin

Barry C Muffoletto

Marc Gregory Martino

Albert Clark Lardo

Kishore Kumar Kondabatni

Brian P Hohl

Jeff Fleigle

Dallas J Rensel

Jonathan Calamel

Matthew A Dobbs

Donald H Hickel, Jr

Mike Louder

Scott W Kelley

Jose Luis Lorente Adame

Haythem Hussein

Thomas Shipman

Bruehl E Truex

Dominck J Frustaci

William Thiebolt, Iii

Donald Hickel

Waren S Dabney

Hussein Haytham

An EMI/energy dissipating filter for an active implantable medical device (AIMD) comprises a first gold braze sealing an insulator to the ferrule of a glass-to-metal seal (GTMS) and a lead wire that is sealed in a passageway through the insulator by a second gold braze. A circuit board is disposed adjacent to the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization connected to its active electrode plates and a ground end metallization connected to its ground electrode plates. A ground electrical path extends from the ground end metallization of the chip capacitor, through a circuit board ground plate disposed on or within the circuit board, and to the ferrule. An active electrical path extends from the active end metallization of the chip capacitor to the lead wire of the GTMS.

Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough

A feedthrough terminal assembly for active implantable medical devices includes an electrically conductive pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. The electrically conductive pad enables direct thermal or ultrasonic bonding of a circuit board or lead wire to the terminal pin.

Feedthrough terminal assembly with an electrically conductive pad conductively connected to a terminal pin

A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.

Hermetic terminal for an AIMD having a pin joint in a feedthrough capacitor or circuit board

An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active metallization that is electrically connected to the active electrode plates and a ground metallization that is electrically connected to the ground electrode plates of the capacitor. A ground electrical path extends from the ground metallization of the chip capacitor to the ferrule. A conductive ground pin is electrically and mechanically connected to the ferrule. The ground path comprises an internal ground plate disposed within the circuit board substrate. The internal ground plate is electrically connected to the ground metallization of the chip capacitor and to either the ferrule or the ground pin connected to the ferrule. An active electrical path extends between the active metallization of the chip capacitor and the lead wire.

MLCC filter on an aimd circuit board conductively connected to a ground pin attached to a hermetic feedthrough ferrule

An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400&#xb0; C. to about 700&#xb0; C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400&#xb0; C. to about 1,900&#xb0; C. for up to 6 hours; and a cool down portion at a rate of up to 5&#xb0;/minute from a maximum sintering temperature down to about 1,000&#xb0; C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.

Method for providing a hermetically sealed feedthrough with co-fired filled via for an active implantable medical device

A three-terminal flat-through EMI/energy dissipating filter comprises an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. Both the effective capacitance area or overlapping surface area of the active electrode plate and the surrounding ground shield plates and the dielectric constant of the insulating layers between the active electrode plate and the ground shield plates is raised to achieve a higher capacitance value for the three-terminal flat-through capacitor.

Flat-through capacitor mounted in a tombstone position on a hermetic feedthrough for an active implantable medical device

Filtered feedthrough assembly having an MLCC filter capacitor on an AIMD circuit board attached to the ferrule of a hermetic feedthrough

A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization. An active electrical path extends from the first leadwire to the second leadwire to an MLCC chip capacitor mounted on the circuit board and to the circuit board active circuit trace, and a ground electrical path extends from the MLCC chip capacitor to the circuit board ground metallization and then to the ferrule.

Circuit board mounted filtered feedthrough assembly having a composite conductive lead for an AIMD

A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.

Process for manufacturing a leadless feedthrough for an active implantable medical device

A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device

A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.

A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device

An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.

Hermetic terminal for an AIMD having a composite brazed conductive lead

Growing community of inventors

Carson City, NV, United States of America

Richard L Brendel