Ersa Gmbh

Richard Kressmann

Rainer Kurtz

Johannes Stahl

Christoph Wolpert

Simon Hame

Michael Schäfer

Bernd Schenker

A soldering pump for pumping an electrically conductive fluid&#x2014;in particular, a liquid solder&#x2014;said soldering pump having a feed channel which travels at least in segments along a circular path and has an inlet and an outlet, and having a device for generating a moving magnetic field, wherein the device comprises at least one permanent magnet, wherein the device is designed such that the permanent magnet is moved along the feed channel during operation.

Soldering pump

The present invention relates to a device for thermally treating workpieces that are equipped with electrical and electronic components, including at least one process chamber in which at least one heating or cooling zone is formed or disposed, wherein a temperature-controlled gaseous fluid can be introduced into said heating or cooling zone, wherein the workpieces pass through the heating or cooling zone and heat is transferred in a convective manner between the workpieces and the temperature-controlled fluid, and including at least one temperature measuring element disposed in the process chamber, wherein at least one sensor element that has a defined mass is disposed in the process chamber, such that heat is convectively transferred between the sensor element and the fluid, and an apparatus is provided for cooling and/or heating the sensor element, wherein the temperature of the sensor element can be measured by the temperature measuring element.

Device and method for thermally treating workpieces in particular by convective heat transfer

A facility for the thermal treatment of workpieces has a processing or heating chamber and at least one transport device, extending essentially completely through the processing or heating chamber, with which the workpieces to be treated can be transported through the processing or heating chamber. At least two processing or heating levels are hereby located on top of one another in the processing or heating chamber, with each processing or heating level having at least one separate transport device. This type of facility can preferably be used as a soldering facility, particularly a reflow soldering facility, or as a facility for the hardening or drying of plastics or adhesives.

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Zell, Germany

Richard Kressmann