Honeywell International Inc.

Honeywell G.m.b.h.

Richard Kirkpatrick

Ralph Herbert Johnson

Lamar Floyd Ricks

Ian Bentley

Richard B Bishop

Fred Hintz

Gregory R Furlong

Yousef M Alimi

Joshua Jacque Edberg

John R Hines

Methods, apparatuses and systems for providing offset calibration and fault monitoring are disclosed herein. An example controller component may comprise: a resistance-based bridge circuit; a signal conditioning circuit configured to condition an output of the resistance-based bridge circuit; a first diagnostic circuit coupled to the signal conditioning circuit configured to monitor an output of a first branch of the resistance-based bridge circuit; and a second diagnostic circuit coupled to the signal conditioning circuit configured to monitor an output of a second branch of the resistance-based bridge circuit.

Offset calibration and diagnostics for resistance-based bridge circuits

A packaged sensor having three external electrical terminals. The packaged sensor comprises a package housing, a power input terminal, a ground terminal, a sensing device, a sensor output terminal for providing an output signal that is related to a physical quantity sensed by the sensing device when the packaged sensor is operated in a sensing mode of operation and for providing a data readout signal related to stored data when the packaged sensor is operated in a data readout mode of operation, a sensing block coupled to the sensing device and to the sensor output terminal, and an adjustment block coupled to the power input terminal, coupled to the sensing block, coupled to the sensor output terminal, comprising a memory storing the stored data, and operable to modulate the data readout signal onto the sensor output terminal in response to a data readout command modulated onto the power input terminal.

In-package sensor memory readout

An integrated circuit for implementing brushless DC motor control includes a substrate, a band gap temperature sensor, and a magnetic sensor. The substrate has a temperature output pin for connection to an external device and a magnetic sensor output pin for connection to the external device. The band gap temperature sensor is formed on the substrate and is configured to sense temperature and supply a temperature signal representative of the sensed temperature to the temperature output pin. The magnetic sensor is formed on the substrate and is configured to sense magnetic field variations and supply a sensor output signal representative thereof to the magnetic sensor output pin.

Multi-phase brushless DC motor control integrated circuit having magnetic sensor and band-gap temperature sensor formed thereon

An illustrative packaged magnetic field sensor includes a power input terminal and a sensor output terminal, both accessible from outside of the package housing. A sensing block is situated in the package housing and electrically coupled to the magnetic field sensing device and the sensor output terminal. An adjustment block is situated in the package housing and coupled to the power input terminal and the sensing block. In some cases, the adjustment block may receive one or more messages that include sensor adjustment information. The one or more messages may be modulated onto the power input signal. The adjustment block may decode the received sensor adjustment information from the messages, and store the decoded adjustment information into a memory. The adjustment block may then adjust the output signal of the sensing block based on the decoded adjustment information.

Method and apparatus for performing in-package sensor adjustments

A structure is formed from two layers of material having opposite conductivity types. A first region is formed within the structure, and extends at least in part into a layer to be etched. A surface of the structure is then masked and etched. The result is a microstructure which varies with the conductivity type and geometry of the region formed and etchant used.

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Richardson, TX, United States of America

Richard Kirkpatrick