E.i. Dupont De Nemours and Company

Richard Kevin Bailey

Lynda Kaye Johnson

Jeffrey Scott Meth

Graciela Beatriz Blanchet

Feng Gao

Reid John Chesterfield

John W Catron, Jr

Gary Delmar Jaycox

Rinaldo Soria Schiffino

Irina Malajovich

Geoffrey Nunes

Marc Bruce Goldfinger

Kenneth George Sharp

Roupen Leon Keusseyan

Gerald Donald Andrews

Thomas C Felder

Gerard O'Neil

Elizabeth Forrester McCord

Jonathan V Caspar

Dalen E Keys

Nancy G Tassi

William J Marshall

Paul J Shannon

Hong Meng

Howard David Glicksman

Charles Nehemiah McEwen

Mark Andrew Harmer

Karyn B Visscher

Frank S Principe

Charles Nehemiah McEwan

Robert Mar Yohannan

John Catron

Gerald D Andrews

Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.

Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom

The invention is related to thermal imageable dielectric layers and thermal transfer donors and receivers comprising dielectric layers. The thermal transfer donors are useful in making electronic devices by thermal transfer of dielectric layers having excellent resistivity, good transfer properties and good adhesion to a variety of receivers.

Thermally imageable dielectric layers, thermal transfer donors and receivers

The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.

Donor elements and processes for thermal transfer of nanoparticle layers

The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.

Thin film transistor comprising novel conductor and dielectric compositions

Metal compositions including silver compositions are used in preparing thermal imaging donors. The donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Provided are processes for enhancing the resolution of a thermally transferred pattern on an imaged thermal transfer receiver, wherein the imaged thermal transfer receiver comprises a surface having an exposed portion and a non-exposed portion of one or more thermally transferred layer(s), comprising: (a) contacting said surface with an adhesive layer for a contact period to provide a laminate; (b) separating said adhesive layer from the laminate to provide a treated thermal transfer receiver having a surface substantially free of said non-exposed portion of one or more thermally transferred layer(s). The processes are useful in the fabrication of electronic devices including thin film transistors, circuits, electromagnetic interference shields, touchpad sensors and other electronic devices.

Process for enhancing the resolution of a thermally transferred pattern

The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

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Newark, DE, United States of America

Richard Kevin Bailey