Visteon Global Technolgoies, Inc.

Ford Motor Company Limited

Visteon Global Tech., Inc

Other

Ford Global Technolgoies, LLC

Richard Keith McMillan

Vivek Amir Jairazbhoy

Andrew Zachary Glovatsky

Jay DeAvis Baker

Delin Li

Lakhi Nandlal Goenka

Myron Lemecha

Zhong-You Joe Shi

Mohan R Paruchuri

Robert Edward Belke

Michael George Todd

Lawrence LeRoy Kneisel

Brenda Joyce Nation

Thomas Bernd Krautheim

Harvinder Singh

Daniel Roger Vander Sluis

Bernard A Meyer

Yi-Hsin Pao

Michael Allen Howey

Bjoern Erik Brunner

John Trublowski

George Albert Garfinkel

Achyuta Achari

Daniel Phillip Dailey

Robert Joseph Gordon

Robert Edward Belke, Jr

Marc Alan Straub

Charles Frederick Schweitzer

Jun Ming Hu

Ram S Raghava

Peter Langer

Bharat Z Patel

Antonio Aires

Nelson Lima

Andre Mendiboure

David James Steinert

Pawel Kalinowski

Jin Zhou

Donald S Hanson

Xu Song

Mathias Stegemann

Cindy Maria Rutyna

Aleksandar Georgi Lukanov

Chan-Jiun Jih

Walter Kuzma Stepanenko

A method of forming a curved, rigid display article includes providing a first substrate having a first initial geometry and a second substrate having a second initial geometry, wherein the first substrate and the second substrate are bendable at room temperature. The method includes optically bonding the first substrate and the second substrate together with a layer of optical bonding material to form an initial workpiece having a geometry that matches one of the first initial geometry and the second initial geometry. The method also includes shaping the initial workpiece to form a shaped workpiece having a radius of curvature of at least 0.1 mm. The method also includes structurally bonding together the shaped workpiece and a curved frame that is not flexible and has a final radius of curvature of from 0.1 mm to 300 mm with an adhesive to thereby form the curved, rigid display article.

Method of forming a curved, rigid display article

An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.

Electronically integrated vehicle structure

An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.

Integrated light and accessory assembly

An automobile instrument panel assembly may be used in the cockpit of an automobile. The assembly includes a cross-car structure having a plurality of recesses and protrusions along the length of the structure and a plurality of generally planar surfaces. A plurality of HVAC components are adapted to closely fit within one or more of the plurality of recesses within the structure, and at least one flatwire bus is affixed to the generally planar surfaces of the structure.

Instrument panel with integrated HVAC and electronic systems

The present invention involves a light channel communication component for a vehicle interior member. The light channel communication component comprises an integral polymeric body being a signal-conductive integral medium for transmitting light signals therethrough. The integral polymeric body has a predetermined index of refraction through which the light signals are transmitted. The integral polymeric body further includes a structure of the vehicle interior member to support a shape of the vehicle interior member.

Light channel communication system

An integrated control system comprising an integrated circuit that controls at least one component or subsystem of an engine and a first light source that generates a first light signal when triggered through the integrated circuit. The first light signal propagates from the first light source through an LCC that may also serve as a substrate, wherein the signal that actuates the component of the engine can be the first light signal or a signal generated after the first light signal is produced. The component or subsystem of the engine may be an ignition system or a fuel injection system. The present invention is also directed to a method of controlling a component or subsystem of an engine.

Optically controlled IPCS circuitry

A method for making multi-layer circuit boards having metallized apertures which may be selectively and electrically grounded and having at least one formed air-bridge

Circuit board and a method for making the same

A method for making a multi-layer circuit board having at least one electrically conductive interconnection portion or &ldquo;via&rdquo; which extends within the board and at least one air-bridge The method includes the steps of forming protuberances upon a core member attaching pre-circuit assemblies to the core member thereby forming the circuit board while concomitantly and selectively extending at least one of the protuberances within the formed circuit board

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically grounded or isolated from an electrical ground plane.

Method for making an electrical circuit board

A multi-layer electronic circuit board design having a core member a pair of dielectric layers disposed thereon, and a first circuit portion which is coupled to the dielectric layer and core member using a layer of adhesive material Circuit board design further having selectively formed &ldquo;blind&rdquo; apertures, vias or cavities formed through the first circuit portion dielectric layer and adhesive layer thereby exposing core member

Electrical circuit board and a method for making the same

Method of making a circuit board

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically connected to a source of ground potential.

Method for making a circuit board

There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate having at least one mounting pad thereon, wherein each mounting pad is arranged in matched relation with a respective termination of an electronic component . Each mounting pad includes a main body portion and one or more fingerlike extensions extending outward from the main body portion and away from a projected footprint of the electronic component.

Enhanced mounting pads for printed circuit boards

There is disclosed herein a printed circuit board (PCB) having improved resistance against solder bridging and component decentering/tombstoning. The printed circuit board (PCB) includes a substrate,having a top surface,; at least two mounting pads,disposed on the top surface in matched relation with terminations,of an electronic component,; and a solder mask,disposed on the top surface and having at least two apertures,therethrough, wherein each aperture generally conforms in shape with and is arranged about a respective one of the mounting pads,. Each aperture,has at least one inner aperture edge,generally within a projected footprint F of the electronic component and at least one outer aperture edge,generally outside the footprint F. Each aperture,includes a notch,in one or more of the at least one outer aperture edge,, wherein each notch,extends generally outward from its respective mounting pad,. The notch,provides a reservoir in the solder mask aperture,about each pad,, into which flux, other solder paste effluents, and solder balls may be channeled and remain contained.

Anti-bridging solder ball collection zones

An electronic circuit assembly having anti-tombstoning solder joints, including: a substrate,having at least one mounting pad,thereon; an SMD,having at least one termination,; and at least one solder joint,connecting each termination,to its respective mounting pad,. Each solder joint,is convex in shape, having a continuous and substantially circular arcuate outer profile,and covering substantially all of the mounting pad,and substantially all of a top portion,of each termination,. Each mounting pad,has a predetermined length l,and each solder joint has a predetermined volume of solder selected such that a positive net anti-tombstoning moment is exerted upon the SMD,when at least one solder joint,is in a molten state.

Anti-tombstoning solder joints

Growing community of inventors

Dearborn, MI, United States of America

Richard Keith McMillan