Honeywell G.m.b.h.

Richard K Speilberger

Thomas J Dunaway

Lori A Dicks

Jerald M Loy

Luverne O Balgaard

Disclosed is a system and method for controlled compression furnace bonding of a semiconductor chip to conductive elements of a leadframe. The system comprises a holding member having a chip support surface for supporting a semiconductor chip and a positioning system for precisely positioning conductive elements of a leadframe with corresponding bonding locations on the semiconductor chip. A furnace heating system comprising a furnace is employed for heating and bonding the conductive elements to the chip bonding locations. The method invention comprises positioning a semiconductor chip comprising a plurality of bonding locations in a holding member with a chip support surface; providing performed bonding material for connecting conductive elements of a leadframe with the chip bonding locations; aligning the conductive elements of a leadframe with corresponding bonding locations on the semiconductor chip; moving the leadframe conductive elements toward the chip bonding locations so that the bonding material is aligned with the conductive elements in the chip bonding locations; furnace bond heating the bonding material to a point of reflow; and cooling the bonding material to complete the bonding process between the leadframe conductive elements and the corresponding chip bonding locations.

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Maple Grove, MN, United States of America

Richard K Speilberger