Visteon Global Technolgoies, Inc.

Ford Motor Company Limited

Richard K McMillan, Ii

Antonio Aires

Andre Mendiboure

Nelson Lima

Carlos Caldeira

Hugo Cardoso

Abhilash Marthi Somashankar

Andre Ruza

Jay DeAvis Baker

Myron Lemecha

Paul E Stevenson

Bernard A Meyer

Wells L Green

Kenneth A Salisbury

Thomas B Merala

Matti Mikkor

A method of forming a display article includes dispensing a material onto a first substrate, and pre-curing the material to form a dam. The method includes depositing a liquid optically clear adhesive in a first pattern onto the first substrate such that the first pattern is spaced apart from the dam to form a coated first substrate. The method includes depositing the adhesive in a second pattern onto a second substrate to form a coated second substrate, and flipping the coated second substrate upside down. The method includes translating the coated first and second substrates towards one another to eliminate an air gap, contacting the first pattern and the second pattern at a plurality of single points, and compressing the first pattern and the second pattern to eliminate the air gap and air entrained between the coated first and second substrates.

Optical workpiece

Method of eliminating entrained air between substrates during optical bonding

A micro soldering apparatus and method comprising a system (10) for attaching an electronic component (12) to a substrate (14). The system (10) comprises a soldering tool (16) including a dispensing orifice assembly (18) for pulsatingly dispensing a controlled quantity of molten solder (19) to a component (12) and substrate (14) so that the component is joined to the substrate (14) mechanically and electrically upon solidification of the molten solder (19). There is no physical contact between the dispensing orifice assembly (18) and joint. The system (10) also includes a controller for the soldering tool (16). The controller functions in response to process control parameters so that the controlled quantity of molten solder (19) is dispensed through a non-oxidizing atmosphere by a pressure pulse applied to the molten solder.

Micro soldering system for electronic components

Growing community of inventors

Dearborn, MI, United States of America

Richard K McMillan, Ii