Koninklijke Philips Corporation N.v.

Richard Jozef Maria Waelen

Theodorus Martinus Michielsen

Henricus Godefridus Rafael Maas

A method for bonding two plate-shaped objects () with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects () with the adhesive in between are transported into a cure chamber () comprising an ultraviolet lamp () and a heating element (). A movable heat-shielding member () is temporary present between the objects () and the heating element () during at least the first part of the irradiation treatment. Preferably, the heat-shielding member () is positioned outside the cure chamber () during a part of the cure treatment.

Device for bonding two plate-shaped objects

A method for bonding two plate-shaped objects () with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects () with the adhesive in between are transported into a cure chamber () comprising an ultraviolet lamp () and a heating element (). A moveable heat-shielding member () is temporary present between the objects () and the heating element () during at least the first part of the irradiation treatment. Preferably, the heat-shielding member () is positioned outside the cure chamber () during a part of the curve treatment.

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Nijmegen, Netherlands

Richard Jozef Maria Waelen