Abb Power Electronics Inc.

Lucent Technologies Inc.

Richard John Yeager

Alok Kumar Lohia

Thang Danh Truong

John Andrew Trelford

Arturo Silva

Jouni Uusitalo

Loc Ngo

An Ba Nguyen

Kevin Gerard Shaw

Steven John Vargo

Eric K McDonald

William J Edwards

Gary M Edmonds

Edward Yanowski

A power converter is provided. The power converter includes an input side having a first input winding and a second input winding coupled in electrical series to the first input winding. The power converter also includes an output side having a first output winding and a second output winding coupled in electrical parallel to the first output winding.

Single-stage DC-DC power converter

Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.

Interposer printed circuit boards for power modules

Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.

Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.

Spring clips with nesting end portions are disclosed for use in securing heat generating electrical devices to a support surface, such as a heat sink. The nesting end portions of the clips depend downwardly below the main body portion to prevent contact with edges of electrical devices of varying height and width. Thickness and temper of the clips provide some flexibility so there is less variability in clamping force applied to the clamped devices by the clip in response to tightening of the attachment means and torquing of the fastening means becomes less critical.

Growing community of inventors

Rockwall, TX, United States of America

Richard John Yeager