Fei Comapny

Richard J Young

Thomas Gary Miller

Brian Routh, Jr

Chad Rue

Peter D Carleson

Stacey Stone

Jeffrey Blackwood

Michael Schmidt

Valerie Brogden

Reinier Louis Warschauer

Todd Templeton

Dhruti Trivedi

Brennan Peterson

Michael Moriarty

Rudolf Johannes Peter Gerardus Schampers

Brad Larson

Aditee Shrotre

Lucille Ann Giannuzzi

John F Flanagan, Iv

Clive D Chandler

Alexander Henstra

Mark Utlaut

Milos Toth

Paul P Tesch

Johannes Jacobus Lambertus Mulders

Gerard Nicolaas Anne Van Veen

Robert L Gerlach

Tom Miller

Jeff Blackwood

Hendrik Gezinus Tappel

Alan Frank De Jong

Ryan Tanner

John M Lindquist

Ian Johannes Bernardus Van Hees

Paul Anzalone

Daniel W Phifer, Jr

Danny Lankers

Karl D Van Der Mast

Eric S Boleyn

Jr Brian Routh

Johannes Mulders

Van Gerard Veen

Ian Hees Van

Lucille Giannuzzi

Methods and systems for implementing artificial intelligence enabled preparation end-pointing are disclosed. An example method at least includes obtaining an image of a surface of a sample, the sample including a plurality of features, analyzing the image to determine whether an end point has been reached, the end point based on a feature of interest out of the plurality of features observable in the image, and based on the end point not being reached, removing a layer of material from the surface of the sample.

Artificial intelligence-enabled preparation end-pointing

Techniques are described that facilitate automated extraction of lamellae and attaching the lamellae to sample grids for viewing on transmission electron microscopes. Some embodiments of the invention involve the use of machine vision to determine the positions of the lamella, the probe, and/or the TEM grid to guide the attachment of the probe to the lamella and the attachment of the lamella to the TEM grid. Techniques that facilitate the use of machine vision include shaping a probe tip so that its position can be readily recognized by image recognition software. Image subtraction techniques can be used to determine the position of the lamellae attached to the probe for moving the lamella to the TEM grid for attachment. In some embodiments, reference structures are milled on the probe or on the lamella to facilitate image recognition.

Automated TEM sample preparation

A method and apparatus for altering the orientation of a charged particle beam sample is presented. Embodiments of the method includes providing a first work piece on a sample stage having a sample stage plane, the first work piece including a lamella plane in a first orientation. A sample is milled from the first work piece using an ion beam so that the sample is substantially free from the first work piece. A probe is attached to the sample, the probe including a shaft having a shaft axis, the shaft axis oriented at a shaft angle in relation to the sample stage plane, the shaft angle being non-normal to the sample stage plane. The probe is rotated about the shaft axis through a rotational angle so that the lamella plane is in a second orientation. The sample is attached to or placed on the sample on either the first work piece, the first work piece being the work piece from which the sample was milled, or on a second work piece, the second work piece being a work piece from which the sample was not milled. The sample is thinned using the ion beam to form a lamella, the lamella being oriented in the lamella plane.

TEM sample preparation

A method for Transmission Electron Microscopy (TEM) sample creation. The use of a Scanning Electron Microscope (SEM)&#x2014;Scanning Transmission Electron Microscope (STEM) detector in the dual-beam focused ion beam (FIB)/SEM allows a sample to be thinned using the FIB, while the STEM signal is used to monitor sample thickness. A preferred embodiment of the present invention can measure the thickness of or create TEM and STEM samples by using a precise endpoint detection method. Preferred embodiments also enable automatic endpointing during TEM lamella creation and provide users with direct feedback on sample thickness during manual thinning. Preferred embodiments of the present invention thus provide methods for endpointing sample thinning and methods to partially or fully automate endpointing.

Measurement and endpointing of sample thickness

An improved method of high accuracy beam placement for local area navigation in the field of semiconductor chip manufacturing. Preferred embodiments of the present invention can also be used to rapidly navigate to one single bit cell in a memory array or similar structure, for example to characterize or correct a defect in that individual bit cell. High-resolution scanning is used to scan only a 'strip' of cells on the one edge of the array (along either the X axis or the Y axis) to locate a row containing the desired cell followed by a similar high-speed scan along the located row (in the remaining direction) until the desired cell location is reached. This allows pattern-recognition tools to be used to automatically 'count' the cells necessary to navigate to the desired cell, without the large expenditure of time required to image the entire array.

High accuracy beam placement for local area navigation

Plan view sample preparation

A device for imaging and processing a workpiece having nanometric features through the use of at least one charged particle beam, by both fully automated procedures and manual assistance procedures. The device includes a user interface, including a schedule input entry device and a human operator ready input that can be placed in a first state or a second state and a procedure scheduler, accepting a schedule of procedures, including fully automated procedures and manual assistance procedures, from the schedule input entry device. Additionally, a procedure sequencer that, when the human operator ready input is in the second state, sequences through fully automated procedures until the human operator ready input is placed into the first state, at which time the sequencer begins sequencing the manual assistance procedures, after reaching a safe termination point for the fully automated procedures being performed.

Sequencer for combining automated and manual-assistance jobs in a charged particle beam device

An improved method of high accuracy beam placement for local area navigation in the field of semiconductor chip manufacturing. Preferred embodiments of the present invention can also be used to rapidly navigate to one single bit cell in a memory array or similar structure, for example to characterize or correct a defect in that individual bit cell. High-resolution scanning is used to scan only a 'strip' of cells on the one edge of the array (along either the X axis and the Y axis) to locate a row containing the desired cell followed by a similar high-speed scan along the located row (in the remaining direction) until the desired cell location is reached. This allows pattern-recognition tools to be used to automatically 'count' the cells necessary to navigate to the desired cell, without the large expenditure of time required to image the entire array.

Electron-beam-induced chemical reactions with precursor gases are controlled by adsorbate depletion control. Adsorbate depletion can be controlled by controlling the beam current, preferably by rapidly blanking the beam, and by cooling the substrate. The beam preferably has a low energy to reduce the interaction volume. By controlling the depletion and the interaction volume, a user has the ability to produce precise shapes.

Charged particle beam processing

An improved method of high accuracy beam placement for local area navigation in the field of semiconductor chip manufacturing. This invention demonstrates a method where high accuracy navigation to the site of interest within a relatively large local area (e.g. an area 200 &#x3bc;m&#xd7;200 &#x3bc;m) is possible even where the stage/navigation system is not normally capable of such high accuracy navigation. The combination of large area, high-resolution scanning, digital zoom and registration of the image to an idealized coordinate system enables navigation around a local area without relying on stage movements. Once the image is acquired any sample or beam drift will not affect the alignment. Preferred embodiments thus allow accurate navigation to a site on a sample with sub-100 nm accuracy, even without a high-accuracy stage/navigation system.

A method for Transmission Electron Microscopy (TEM) sample creation. The use of a Scanning Electron Microscope (SEM)&#x2014;Scanning Transmission Electron Microscope (STEM) detector in the dual-beam focused ion beam (FIB)/SEM allows a sample to be thinned using the FIB, while the STEM signal is used to monitor sample thickness. A preferred embodiment of the present invention can measure the thickness of or create TEM samples by using a precise endpoint detection method. Preferred embodiments also enable automatic endpointing during TEM lamella creation and provide users with direct feedback on sample thickness during manual thinning. Preferred embodiments of the present invention thus provide methods for endpointing sample thinning and methods to partially or fully automate endpointing.

Growing community of inventors

Portland, OR, United States of America

Richard J Young