Teraconnect, Incorporated

Altera Corporation

Bae Systems Information and Electronic Systems Integration Inc.

Richard J Williams

Mani Sundaram

John A Trezza

Rick L Thompson

Gregory K Duddoff

Thomas S Faska

Barry R Arsenault

Alan E Tobey

Jason S Bundas

Michael F Taylor

Ronald J Olson, Jr

A multi-wavelength optical communication system includes a number of emitters each of which emits radiation at a different wavelength; a plurality of the detectors each of which senses radiation at a different wavelength corresponding to the radiation from one of the emitters and a shared waveguide including a scattering medium to transmit emitted radiation to the detectors.

Multi-wavelength optical communication system

A semiconductor-based, photo detector device capable of simultaneously detecting two or more selected wavelengths of light on a pixel-registered basis. The device has detector layers of selected semiconductor materials of one micron or less in thickness interspersed with contact layers, each detector layer having a different light absorption to wavelength response curve. All contact layers, including detector bias voltages, have electrical contacts on the backside of the pixel for discrete pixel connection to mating connections on a suitable ROIC substrate. Among its several embodiments, there is a multi-color detector array and a single channel per pixel differential optical signal detector.

Multi-color, multi-focal plane optical detector

A system to facilitate alignment of an optical connector to respective optical channels of one or more optical arrays. Optical planar arrays having multiple optical emitters and multiple optical detectors of a multi-channel optical link are aligned by employing supporting circuitry and software that controls the optical devices, enabling all receivers, turning on the transmitters sequentially, and recording the optimal transmitter/receiver pairs. Another feature of the invention is the aspect of redundancy, wherein the system establishes a record of spare emitters and spare detectors that are used when the selected transmitter receiver pair degrades or fails. The techniques of the present invention also provide a unique multiplexer/demultiplexer arrangement for a single wavelength channel of emitters and detectors.

Self aligning optical interconnect with multiple opto-electronic devices per fiber channel

A fiber optic cable connector including a coupler body with a channel for receiving a connector plug therein; and a door spanning the channel, the door biased to cover the channel but displaceable with respect to the channel when the plug body is received in the channel to prevent light from escaping the channel when the plug body is removed from the channel.

Fiber optic cable connector

An optical array chip ( ) is flip-chip bonded to ASIC substrate ( ), and electrically connected to its supporting circuitry through compressively joined solder bump sets ( ) and ( ). Flowable epoxy hardener material ( ) is applied to underfill between the surfaces of chip ( ) and the ASIC surface, surrounding the bump contact sets and filling a standoff cavity system that had been etched in the electrical interface side of chip ( ) to a depth greater than electrical layer ( ) of chip ( ) by the amount of the pre-determined standoff height, prior to application of its bump contacts. Standoff grid ( ) and individual optical devices ( ) are exposed after lapping and etching of the optical interface side of chip ( ) down to the level of electrical layer ( ). The grid structure may have other forms, such as a vertical perimeter standoff ridge surrounding chip ( ) or penetrating electrical layer ( ), or a distributed pattern of vertical posts or wall sections penetrating electrical layer (66).

Precision grid standoff for optical components on opto-electronic devices

A fiber optic connector including a molded alignment coupler including a base plate, an opening in the base plate, and at least one alignment channel in the base plate. A housing upstanding from base plate surrounds the opening and the one alignment channel; and an insert plate is placed in the housing, the insert plate including an opening etched therethrough corresponding to the opening in the base plate of the coupler, and at least one channel etched in the insert plate corresponding to the alignment channel of the coupler.

Fiber optic connector

The present invention features a packaging system for two-dimensional optoelectronic arrays. In one embodiment, the packaging includes a heat spreader, a housing with embedded electrical interconnections, a substrate including electrical contacts, an application specific integrated circuit (ASIC) including a hybridized array with vertical cavity surface emitting laser (VCSEL), detectors or both. The waveguide assembly includes a plurality of individual one-dimensional waveguides formed in waveguide sheets, wherein the waveguides match the array footprint on one end and a connector footprint on the other end.

Packaging system for two-dimensional optoelectronic arrays

A method for alignment in software and supporting circuitry of the optical transmitters and receivers to their respective optical channels at each connection of a multi-channel optical link to an optical planar array, permits non-critical physical alignment of the connector to the optical array. The steps include: employing a connector and optical array configuration at each connection in which there are several optical devices within the illumination area of each channel at the connector/array interface, employing supporting circuitry and software that has control of all optical devices associated with the optical link, enabling all receivers, turning on the transmitters sequentially, recording which of the receivers is responding, comparing matching receiver sets for each transmitter to identify associated transmitter sets and channels.

Growing community of inventors

Hollis, NH, United States of America

Richard J Williams