3m Innovative Properties Company

Minnesota Mining and Manufacturing Company

Exclusive Design Company

Richard J Webb

Wesley J Bruxvoort

John J Gagliardi

Christopher John Rueb

Daniel B Pendergrass, Jr

Carl R Kessel

Bhaskar V Velamakanni

Denise R Rutherford

Douglas P Goetz

Robert J Streifel

Michael J Muilenburg

William J Hollywood

Jerry J Fizel

Chong-Yong J Kim

Cristina U Thomas

James D Buhler

Thomas P Klun

Scott R Culler

Caroline M Ylitalo

Clyde D Calhoun

Joseph D Rule

Larry D Boardman

John Charles Clark

James P Endle

Travis L Potts

David A Kaisaki

Heather K Kranz

Caitlin E Meree

Joshua M Fishman

Kwok-Lun Ho

Robert P Messner

Julia P Williams

Hannah L Mathers

A hearing-protective earplug () with a resilient polymeric foam body () and with a grippable stem () that includes a forward portion () with an annular sleeve () that at least partially defines an open-ended, front-facing cavity () within which a rearward portion () of the resilient polymeric foam body resides.

Earplug with stem comprising a sleeve

Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Method for manufacturing thin substrate using a laminate body

A method for polishing a wafer comprising an aqueous solution having a pH in the range of 6 to 8, wherein the aqueous solution comprises at least one compound selected from the group consisting of a polymethacrylic acid, a polysulfonic acid, and combinations thereof, and wherein the compound is present in the range of 1.5 to 4 percent by weight of the aqueous solution. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.

Method of polishing a wafer

A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.

Wafer planarization composition and method of use

A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.

Abrasive article having a window system for polishing wafers, and methods

An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.

Abrasive construction for semiconductor wafer modification

A method of modifying an exposed surface of a semiconductor wafer that includes the steps of:

Method of modifying an exposed surface of a semiconductor wafer

The present invention provides an abrasive article that has abrasive composite members secured firmly in recesses in a backing sheet in a precise pattern whereby there is desired lateral spacing between each abrasive composite member. The present invention also provides a method for preparing the abrasive article comprising the steps of providing an embossed backing sheet having a plurality of recesses in the front surface of the backing sheet. The recesses are filled with an abrasive slurry that includes a plurality of abrasive grains dispersed in a binder precursor. An expanding agent is also provided in the recesses, either separate from the slurry or dispersed in the slurry. The expanding agent, when activated, expands the abrasive slurry outward and above the front surface of the embossed backing sheet. After the binder precursor of the abrasive slurry is hardened, individual abrasive composite members extend above the front surface of the embossed backing sheet. An alternative embodiment provides recesses that extend completely through the embossed backing sheet, so that abrasive composite members protrude from the front surface and from the back surface of the embossed backing sheet.

Abrasive article having abrasive composite members positioned in recesses

Growing community of inventors

Inver Grove Heights, MN, United States of America

Richard J Webb