Hughes Missile Systems Company

Raytheon Company

General Dynamics Corporation

Richard J Swanson

Garry N Hulderman

Eugene Phillips

Inexpensive and reliable apparatus for blanking the signal path between an antenna and a transmitter or a receiver to protect them from harmful radiation in the absence of power forms supplied thereto. The apparatus is preferably formed as a printed circuit waveguide switch window having a plurality of parallel conductors, such as metal wires or printed circuit traces, disposed on a dielectric substrate. The waveguide switch window is secured between two sections of waveguide. The conductors have a predetermined separation and width that are designed to appear as a solid metal surface that rejects radiation over a wide bandwidth. A bias terminal is coupled to the plurality of conductors, and insulating material is disposed between the bias terminal and the conductors to insulate the top portion of the grid array from the adjacent waveguide. The lower portion of the grid array is grounded to the adjacent waveguide. When the waveguide switch window is in its protective, blanked state, it blocks undesired radiation from entering the antenna and destroying sensitive components in the receiver. When a predetermined voltage is supplied to the bias terminal, it vaporizes the grid array and opens the waveguide switch window to allow normal operation of the antenna and receiver. As proven by tests, the waveguide switch window provides radiation immunity against high level input radiation power and high isolation (30 dB) for receiver protection in the blanked state, and with no measurable loss in the unblanked state.

Low cost, one-shot switch waveguide window

A millimeter wave device having a dielectric substrate with a pair of substantially parallel planar surfaces with at least one predetermined millimeter wave circuit pattern formed in a conductive layer located on at least one of the substrate surfaces. A substantially planar conductive channel plate is mounted adjacent the conductive layer on one substrate surface with the channel plate having an aperture overlying each circuit pattern formed in the conductive layer. A substantially planar conductive cover plate is mounted adjacent one of the channel plates so as to form a first cavity in the region defined by the substrate surface, the channel plate aperture and the cover plate The device may further include a second substantially planar conductive channel plate mounted adjacent the other one of the substrate surfaces with the second channel plate having an aperture corresponding to and aligned with the first channel plate aperture. A second substantially planar conductive cover plate is mounted adjacent the second channel plate so as to form a second cavity in the region defined by the other substrate surface, the second channel plate aperture and the second cover plate. A substantially planar conductive back plate may be mounted adjacent each cover plate to provide support to the device structure. For the production at large quantity, high yield devices, the channel plates, cover plates, and back plates are fabricated by precision techniques such as by photolithography with chemical milling, or electrodischarge machine wire saw fabrication techniques to achieve device high performance operation. In an alternate embodiment of the invention the channel plates, cover plates and back plates are integrally formed for combining photolithography and electroforming techniques.

Millimeter wave device and method of making

A millimeter wave device having a dielectric substrate with a pair of substantially parallel planar surfaces with at least one predetermined millimeter wave circuit pattern formed in a conductive layer located on at least one of the substrate surfaces. A substantially planar conductive channel plate is mounted adjacent the conductive layer on one substrate surface with the channel plate having an aperture overlying each circuit pattern formed in the conductive layer. A substantially planar conductive cover plate is mounted adjacent one of the channel plates so as to form a first cavity in the region defined by the substrate surface, the channel plate aperture and the cover plate. The device may further include a second substantially planar conductive channel plate mounted adjacent the other one of the substrate surfaces with the second channel plate having an aperture corresponding to and aligned with the first channel plate aperture. A second substantially planar conductive cover plate is mounted adjacent the second channel plate so as to form a second cavity in the region defined by the other substrate surface, the second channel plate aperture and the second cover plate. A substantially planar conductive back plate may be mounted adjacent each cover plate to provide support to the device structure. For the production of large quantity, high yield devices, the channel plates, cover plates, and back plates are fabricated by precision techniques such as by photolithography with chemical milling, or electrodischarge machine wire saw fabrication techniques to achieve device high performance operation. In an alternate embodiment of the invention the channel plates, cover plates and back plates are integrally formed by combining photolithography and electroforming techniques.

A method for making a millimeter wave device having a dielectric substrate with a pair of substantially parallel planar surfaces with at least one predetermined millimeter wave circuit pattern formed in a conductive layer located on at least one of the substrate surfaces. A substantially planar conductive channel plate is mounted adjacent the conductive layer on one substrate surface with the channel plate having an aperture overlying each circuit pattern formed in the conductive layer. A substantially planar conductive cover plate is mounted adjacent one of the channel plates so as to form a first cavity in the region defined by the substrate surface, the channel plate aperture and the cover plate. The device may further include a second substantially planar conductive channel plate mounted adjacent the other one of the substrate surfaces with the second channel plate having an aperture corresponding to and aligned with the first channel plate aperture. A second substantially planar conductive cover plate is mounted adjacent the second channel plate so as to form a second cavity in the region defined by the other substrate surface, the second channel plate aperture and the second cover place. A substantially planar conductive back place may be mounted adjacent each cover plate to provide support to the device structure. For the production of large quantity, high yield devices, the channel places, cover plates, and back plates are fabricated by photolithography with chemical milling, to achieve device high performance operation. Alternatively the channel plates and back plates are integrally formed by combining photolithography and electroforming techniques.

Growing community of inventors

Pomona, CA, United States of America

Richard J Swanson