Texas Instruments Corporation

Richard J Saye

Marie Denison

Satyendra Singh Chauhan

Takahiko Kudoh

Sreenivasan Kalyani Koduri

Steven Alfred Kummerl

Michael L Meyers

Scott F Eisenhart

A Multi-Chip Module (MCM) package includes a substrate having a plurality of metal terminals and at least a first die attach area. An encapsulant is around the substrate including on at least a portion of the topside and at least a portion of the bottomside of the package. At least a first device including at least two device terminals is attached face up on the first die attach area. At least a second device including at least two device terminals is flip-chip attached and stacked on the first device. At least one of the first device and second device include a transistor. At least one metal clip is between the first device and second device including a plurality of clip portions isolated from one another connecting at least one device terminal of each of the first device and second device to respective metal terminals of the plurality of metal terminals.

Multi-chip module including stacked power devices with metal clip

A packaged semiconductor device includes a semiconductor die mounted on a leadframe, a housing for the semiconductor die defining a horizontal plane and a horizontal direction. The leadframe includes leads each having an inner lead portion inside the housing and an outer lead portion that includes a first portion that extends out in the horizontal direction from one of the sidewalls of the housing, a transition portion that includes a vertical direction component, and a distal end portion, wherein the distal end portion of the leads are all on the horizontal plane. The outer lead portions alternate between a gull wing lead shape having the distal end portions extending in the horizontal direction outward from the housing and inward extending leads that have their distal end portions extending in the horizontal direction inward toward the housing. The leadframe consists of a single leadframe.

Integrated circuit package including inward bent leads

Circuits and methods of fabricating circuits are disclosed herein. A method of fabricating an electronic circuit includes placing an electronic component on a substrate. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound. The mixed mold compound is applied to the substrate by way of a transfer mold process, wherein the mixed mold compound encapsulates the electronic component.

Method of fabricating an electronic circuit

Fabricating a packaged semiconductor device provides first planar leadframe with first leads and pads having attached electronic components. The first leadframe has a set of elongated leads bent at an angle away from the plane of the first leadframe. A second planar leadframe has second leads having attached electronic components. The bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes.

Packaged semiconductor device having multilevel leadframes configured as modules

A semiconductor system () has a first planar leadframe () with first leads () and pads () having attached electronic components (), the first leadframe including a set of elongated leads () bent at an angle away from the plane of the first leadframe; a second planar leadframe () with second leads () and pads () having attached electronic components (); the bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes; and packaging material () encapsulating the 3-dimensional network.

Growing community of inventors

Greenville, TX, United States of America

Richard J Saye