Growing community of inventors

Carlsbad, CA, United States of America

Richard J Pommer

Average Co-Inventor Count = 4.18

ph-index = 7

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 99

Richard J PommerCharles B Kuznia (10 patents)Richard J PommerRichard T Hagan (10 patents)Richard J PommerJoseph Farzin Ahadian (9 patents)Richard J PommerMan W Wong (3 patents)Richard J PommerScott Moore Zimmerman (1 patent)Richard J PommerBrian Catanzaro (1 patent)Richard J PommerBrad Banister (1 patent)Richard J PommerGeorge F Ahadian (1 patent)Richard J PommerRichard J Pommer (11 patents)Charles B KuzniaCharles B Kuznia (23 patents)Richard T HaganRichard T Hagan (11 patents)Joseph Farzin AhadianJoseph Farzin Ahadian (22 patents)Man W WongMan W Wong (7 patents)Scott Moore ZimmermanScott Moore Zimmerman (85 patents)Brian CatanzaroBrian Catanzaro (8 patents)Brad BanisterBrad Banister (1 patent)George F AhadianGeorge F Ahadian (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Ultra Communications, Inc. (10 from 24 patents)

2. Other (1 from 832,680 patents)


11 patents:

1. 10712508 - Fiber optic end-face transparent protector system and method

2. 10162124 - Fiber optic end-face transparent protector system and method

3. 9784924 - Fiber optic end-face transparent protector

4. 9465176 - Small form factor transceiver compatible with solder processing

5. 9442255 - Low profile fiber-to-module interface with relaxed alignment tolerances

6. 9429496 - Optical time domain reflectometer in a small form factor package

7. 9151916 - Compact optical package made with planar structures

8. 8724944 - Fiber optic bi-directional coupling lens

9. 8348522 - Attachable components for providing an optical interconnect between/through printed wiring boards

10. 8335411 - Fiber optic bi-directional coupling lens

11. 6319811 - Bond ply structure and associated process for interconnection of circuit layer pairs with conductive inks

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as of
12/7/2025
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