Hewlett-packard Development Company, L.p.

Richard J Oram

Siddhartha Bhowmik

Swaroop K Kommera

David M Braun

Sriram Ramamoorthi

Joshua W Smith

Christopher C Aschoff

Phillip G Rourke

Philip G Rourke

Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.

Print head die slot ribs

A slot is formed that reaches through a first side of a silicon substrate to a second side of the silicon substrate. A trench is laser patterned. The trench has a mouth at the first side of the silicon substrate. The trench does not reach the second side of the silicon substrate. The trench is dry etched until a depth of at least a portion of the trench is extended approximately to the second side of the silicon substrate (). A wet etch is performed to complete formation of the slot. The wet etch etches silicon from all surfaces of the trench.

Formation of a slot in a silicon substrate

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Corvallis, OR, United States of America

Richard J Oram