Btu International, Inc.

Richard J Nihan

Francis C Nutter

Martin Soderlund

Martin I Soderland

An apparatus and method for cooling one side of a double sided product as the product is being reflow soldered is presented. A cooling assembly directs cold gas to a first side of the product which has previously had the first side reflow soldered, while at approximately the same time, a heating assembly directs hot gas to a second side of the product. The second side of the product is reflow soldered while the first side of the product is maintained at a temperature below the melting point of the solder.

Apparatus and method for solder reflow bottom cooling

A system provides support for the underside of a planar object, such as a printed circuit board. The system includes a flexible loop having an outer face from which support elements protrude. A guide positions the flexible loop to align the support elements with one or more selected locations on the underside of the object. The system can also include a device for moving the guide toward or away from the object as desired. A tensioning element can be provided that is responsive to displacement of the guide to maintain a substantially constant tension on the loop.

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Dracut, MA, United States of America

Richard J Nihan