Basf Se Corporation

Richard J Lair

Axel Wilms

Stephen J Hanley

Chul S Lee

Randy Fleck

Inga Marie Balke

Marianne S Morgan

Lee Ann Dombrowski

Harold Colwell

David M Lange

An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell.

Method of encapsulating an electronic component

An article manufactured from a polymeric material filled with fibers has an exterior surface having an impact portion with an arcuate configuration to impart impact resistance to the article. The article also includes a plurality of ribs orientated and configured in a unique manner to also impart impact resistance to the article. The ribs extend from the exterior surface of the article. A fillet having a fillet radius interconnects the ribs and the exterior surface. The fibers of the polymeric material are aligned within the article parallel to a flow of the polymeric material when injected into a mold during a molding process. The ribs are oriented in a pattern relative to the fibers to maximize the impact resistance of the article.

Article having impact resistant surface

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Long Valley, NJ, United States of America

Richard J Lair