Sundstrand Corporation

Sunstrand Corporation

Richard J Hoppe

Thomas Albert Sutrina

Lawrence E Crowe

John B Huss

Eric D Lakin

Mark W Metzler

W Kyle Anderson

Edward W Smith

Steven E Jackson

Stephen E Jackson

Merle L Bennett

Derek N Walton

William K Anderson

William J Durako, Jr

Lawrence Hughes

Ronald F Peterson

An electrical power connection module adapted to indicate when a weld between a pin and a socket has occurred. The present invention provides a multiple pin plug wherein each pin mounted in the plug is attached thereto using a spring means. The biasing means is adapted to maintain the pin in a first position if a weld has not occurred, and a second position if a weld has occurred to thereby provide the user with a visual indication of the welded pin. Therefore, rather than requiring that an entire line replaceable unit be removed and replaced at substantial cost and delay, the present invention allows the user to quickly determine which pin has become welded, and to quickly disconnect the welded pin from the plug for removal of the plug and then subsequent removal of the welded pin.

Quick release power connector

This invention relates to an electric power generation and distribution system, and more particularly to an electric power distribution module for use in such systems, having an insulative support structure which includes integral therewith electrically conductive means which define a circuit for distributing electric power received from one or more power sources to one or more electrical loads, the insulative support structure also including integral therewith current sensing means for sensing a flow of electrical current in the electrically conductive means.

Electric power distribution module for an electric power generation and

A power semiconductor assembly, particularly a semiconductor switch assembly which has a number of discrete emitter connection pads, comprised of a metal matrix composite housing and a copper or aluminum post with a cross-sectional area sufficiently large to carry the rated current providing a single-point, external connection to all emitter pads. The post passes through and is supported by an insulating ceramic insert such as aluminum oxide in the wall of the metal matrix composite housing. The post is hollowed out in the region where it passes through the ceramic insert in order to reduce the mechanical stress between the post and the insulating insert as a result of the mismatch in their thermal expansion coefficients. Buses on either side of the semiconductor die provide surfaces for connection from the post to the discrete emitter connection pads on the die.

Metal matrix composite semiconductor power switch assembly

A dual permanent magnet generator (10) is provided with a differential gear arrangement (20) comprising two ring gears (21, 26), two planetary gears (30, 31) and a carrier (32) which is splined to an input shaft (12) in the generator (10) so as to rotate the carrier (32) at the same speed as the input shaft (12) while allowing the input shaft (12) to shift axially. One of the ring gears (21) has a threaded connection (18, 38) with the input shaft (12). Consequently, as either the ring gear (21) or the ring gear (26) is slowed down through the application of a resistive load on small generators (22, 23 and 27, 28) associated with the respective ring gears (21, 26), the threaded connection (18, 38) will cause the input shaft (12) to move axially in one of two directions and, via lefthand and righthand spline connections (15, 16) between the input shaft (12) and main rotors (13, 13'), cam the rotors (13, 13') to shift into and out of phase with respect to each other.

Dual permanent magnet generator planetary gear actuator and rotor phase

Prior power converters have utilized discrete components mounted on circuit boards of differing designs. Failure of one or more of the components requires testing each component to determine which is faulty. The faulty component must then be replaced. This results in significant down time for the inverter and can require stocking a large number of specialized boards. In order to overcome these problems, an inverter is assembled using modular circuit boards. Each circuit board includes components mounted on a multilayer substrate and a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board containing the failed component may be readily replaced so that inverter down time is minimized. The use of modular circuit boards also reduces stocking requirements and inventory costs.

Modular circuit board

Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This results in significant down time for the inverter and can require stocking of a large number of specialized boards. In order to overcome these problems, an inverter is assembled using a series of circuit boards of standardized type. Each circuit board includes separate layers which interconnect components mounted thereon together with a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board may be replaced so that inverter down time is minimized. Also, the use of standardized boards reduces stocking requirements and inventory costs.

Power converter circuit board

A power converter comprises a plurality of modular circuit boards assembled in a stacked relationship. The circuit boards include heat exchangers which are interconnected and cooling fluid is provided thereto to remove heat generated by high power devices.

Stacked power converter

A compression loaded semiconductor device package (40) in accordance with the invention includes a cylindrical semiconductor device (54) having a first region (66) on a first face, a control region (68) on the first face having a central portion (70) and a plurality of projections (72) extending radially from the central portion with the radial projections being symmetrically disposed around the periphery of the first face and a second region (74) on a second face with the second face being opposed to the first face; an electrically conductive contract (48) having an external control terminal (88), an annulus (84) electrically connected to the external control terminal, a plurality of projections (82) electrically connected to the annulus, projecting radially inward and a center (80) electrically connected to the radially inward projections and to the control region; and first and second annular insulators (112 and 114) each insulator having a plurality of faces, the upper cover being bonded to a first face (116) of the first insulator, a second face of the first insulator being bonded to a first attachment ring (122) with the first attachment ring being bonded to the annulus, the lower cover being bonded to a first face (116) of the second insulator, a second face (118) of the second insulator being bonded to a second attachment ring (124) with the second attachment ring being bonded to the annulus, the bonds (120) defining a sealed chamber containing the semiconductor device.

Compression loaded semiconductor device

Plate fin heat exchangers (11,12 or 34,35,36) for transformers (10) and inductors (30) made of laminated iron cores (16 and 44) and insulated wire coils (13,14,15 or 45, 46, 47, 48) placed around the legs of the cores (16 and 44) is provided in the form of a plate fin between the coils of wire. The wire coils (13,14,15 or 45,46,47,48) and respective heat exchangers (11,12 or 34,35,36) are sandwiched together with the leg of the iron core (16 or 44) passing through the sandwich. The heat generated in the coils is in direct contact with the surface of the heat exchangers (11,12 or 34,35,36). A narrow air gap (28 or 49) is incorporated in each of the plate fin heat exchangers (11,12 or 34,35,36) at the core leg of each coil (13,14,15 or 45,46,47,48) to reduce the path eddy currents can travel and thereby reduce eddy current losses which reduce the power of the transformer (10) or inductor (30).

Inductor transformer cooling apparatus

A cooling arrangement is provided for capacitor chips (10) or a capacitor assembly (40). A metal foil (18,18',18',18'') is affixed to a chip (10) with electrical insulation therebetween. The foil (18,18',18',18'') has a free end extending beyond the capacitor periphery and transversely of the capacitor stack (13) and can be provided with an L-shaped end (21) or a tube heat exchanger (23) or a fin plate heat exchanger (24). An assembly (40) of capacitors (30 to 38) can be arranged between legs of U-shaped metal heat exchange members (25,26,27) which conduct heat from the capacitors (30 to 38) through the legs and to a coolplate (28) having a tube (29) for passage of coolant.

Capacitor cooling arrangement

A power supply in accordance with the present invention includes a chassis (26) associated with the power supply; a voltage source (12) providing an output voltage varying at a fundamental frequency and having a noise component changing as a function of time at a frequency above the fundamental frequency; a filter (41) including an inductance (44) in series with the voltage source for attenuating the noise component and outputting the fundamental frequency; and a cooling apparatus (42) thermally and capacitively coupled to the inductor for conducting heat from the inductor and shunting the noise component to the chassis.

Power supply with integral filter and cooling device

Resistance to centrifugally acting forces in an axially and radially compact rectifier assembly particularly suited for mounting in a rotary component of a dynamoelectric machine is achieved in a full wave, three phase rectifier assembly. The assembly includes first and second blocks 18, 20, each having three radially outwardly facing diode receiving surfaces 22, 24, 26. Six diode wafers 28 are located on the surfaces and are sandwiched thereagainst by six electrically conductive load shoes 40. Three phase conductors 54 are interposed between the load shoes 40 and a shrink fitted cylindrical housing 10 and electrically connect aligned load shoes 40 associated with each of the blocks 18 and 20.

Growing community of inventors

Rockford, IL, United States of America

Richard J Hoppe