Kulicke and Soffa Industries, Inc.

Richard J Elles

Albert Soffa

Frederick W Kulicke, Jr

Moshe E Sade

Dan Vilenski

Razon Ely

In a high speed automatic fine wire bonding machine of the type adapted to produce a wire interconnection between two bonding points on a semiconductor device there is provided a method of making consistent, exact predetermined lengths of wire under the working face of a bonding tool after a second bond is finished and in preparation for making the next first bond of a wire interconnection.

Method of making constant bonding wire tail lengths

A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The bonding head is provided with means for articulating the bonding tool in a vertical direction and in a rotational direction. The rotational movement of the novel bonding head does not impart vertical movement to the bonding tool.

Growing community of inventors

Philadelphia, PA, United States of America

Richard J Elles