Freescale Semiconductor,inc.

Nxp USA, Inc.

Motorola Corporation

Richard J De Souza

Patrice M Parris

Weize Chen

Hubert Martin Bode

Md M Hoque

Moaniss Zitouni

Jennifer H Morrison

John M McKenna

Xin Lin

Raymond Mervin Roop

Edouard De Fr&eacute;sart

Jose Fernandez Villasenor

David E Niewolny

Mazhar Ul Hoque

Edouard D De Fresart

Edouard De Frésart

Integrated circuit devices with counter-doped conductive gates. The devices have a semiconductor substrate that has a substrate surface. The devices also have a first well of a first conductivity type, a source of a second conductivity type, and a drain of the second conductivity type. A channel extends between the source and the drain. A conductive gate extends across the channel. The conductive gate includes a first gate region and a second gate region of the second conductivity type and a third gate region of the first conductivity type. The third gate region extends between the first and second gate regions. The devices further include a gate dielectric that extends between the conductive gate and the substrate and also include a silicide region in electrical communication with the first, second, and third gate regions. The methods include methods of manufacturing the devices.

Integrated circuits devices with counter-doped conductive gates

An embodiment of an Ion Sensitive Field Effect Transistor (ISFET) structure includes a substrate, source and drain regions formed within the substrate and spatially separated by a channel region, a gate dielectric and a gate formed over the channel region, multiple conductive structures overlying the surface of the substrate, and one or more protection diode circuits coupled between one or more of the multiple conductive structures and the substrate. The multiple conductive structures include a floating gate structure and a sense plate structure. The floating gate structure is formed over the gate dielectric and includes the gate. The sense plate structure is electrically coupled to the floating gate structure and is configured to sense a concentration of a target ion or molecule in a fluid adjacent to a portion of the sense plate structure.

Ion sensitive field effect transistors with protection diodes and methods of their fabrication

An ISFET includes a control gate coupled to a floating gate in a CMOS device. The control gate, for example, a poly-to-well capacitor, is configured to receive a bias voltage and effect movement of a trapped charge between the control gate and the floating gate. The threshold voltage of the ISFET can therefore by trimmed to a predetermined value, thereby storing the trim information (the amount of trapped charge in the floating gate) within the ISFET itself.

Methods and apparatus for an ISFET

Protected sensor field effect transistors (SFETs). The SFETs include a semiconductor substrate, a field effect transistor, and a sense electrode. The SFETs further include an analyte-receiving region that is supported by the semiconductor substrate, is in contact with the sense electrode, and is configured to receive an analyte fluid. The analyte-receiving region is at least partially enclosed. In some embodiments, the analyte-receiving region can be an enclosed analyte channel that extends between an analyte inlet and an analyte outlet. In these embodiments, the enclosed analyte channel extends such that the analyte inlet and the analyte outlet are spaced apart from the sense electrode. In some embodiments, the SFETs include a cover structure that at least partially encloses the analyte-receiving region and is formed from a cover material that is soluble within the analyte fluid. The methods include methods of manufacturing the SFETs.

Protected sensor field effect transistors

A device includes a semiconductor substrate having a first conductivity type, a device isolating region in the semiconductor substrate, defining an active area, and having a second conductivity type, a body region in the active area and having the first conductivity type, and a drain region in the active area and spaced from the body region to define a conduction path of the device, the drain region having the second conductivity type. At least one of the body region and the device isolating region includes a plurality of peripheral, constituent regions disposed along a lateral periphery of the active area, each peripheral, constituent region defining a non-uniform spacing between the device isolating region and the body region. The non-uniform spacing at a respective peripheral region of the plurality of peripheral, constituent regions establishes a first breakdown voltage lower than a second breakdown voltage in the conduction path.

Integrated breakdown protection

Semiconductor devices and related electrostatic discharge (ESD) protection methods are provided. An exemplary semiconductor device includes an interface for a signal and a multi-triggered protection arrangement coupled between the interface and a reference node to initiate discharge of the signal between the interface and the reference node based on any one of a plurality of different characteristics of the signal. Discharge of the signal at the interface is initiated based on a first characteristic of the signal, and thereafter, the discharge of the signal at the interface is maintained based on another characteristic of the signal.

Semiconductor device and related protection methods

Embodiments of semiconductor devices and driver circuits include a semiconductor substrate having a first conductivity type, an isolation structure (including a sinker region and a buried layer), an active device within a portion of the substrate contained by the isolation structure, and a resistor circuit. The buried layer is positioned below the top substrate surface, and has a second conductivity type. The sinker region extends between the top substrate surface and the buried layer, and has the second conductivity type. The active device includes a body region, which is separated from the isolation structure by a portion of the semiconductor substrate having the first conductivity type. The resistor circuit is connected between the isolation structure and the body region. The resistor circuit may include one or more resistor networks and, optionally, a Schottky diode and/or one or more PN diode(s) in series and/or parallel with the resistor network(s).

Semiconductor device and driver circuit with an active device and isolation structure interconnected through a resistor circuit, and method of manufacture thereof

Embodiments include methods of forming a semiconductor device having a first conductivity type, an isolation structure (including a sinker region and a buried layer), an active device within area of the substrate contained by the isolation structure, and a diode circuit. The buried layer is positioned below the top substrate surface, and has a second conductivity type. The sinker region extends between the top substrate surface and the buried layer, and has the second conductivity type. The active device includes a source region of the first conductivity type, and the diode circuit is connected between the isolation structure and the source region. The diode circuit may include one or more Schottky diodes and/or PN junction diodes. In further embodiments, the diode circuit may include one or more resistive networks in series and/or parallel with the Schottky and/or PN diode(s).

Semiconductor device and driver circuit with source and isolation structure interconnected through a diode circuit, and method of manufacture thereof

Embodiments of semiconductor devices and driver circuits include a semiconductor substrate having a first conductivity type, an isolation structure (including a sinker region and a buried layer), an active device within area of the substrate contained by the isolation structure, and a diode circuit. The buried layer is positioned below the top substrate surface, and has a second conductivity type. The sinker region extends between the top substrate surface and the buried layer, and has the second conductivity type. The active device includes a body region of the second conductivity type, and the diode circuit is connected between the isolation structure and the body region. The diode circuit may include one or more Schottky diodes and/or PN junction diodes. In further embodiments, the diode circuit may include one or more resistive networks in series and/or parallel with the Schottky and/or PN diode(s).

Semiconductor device and driver circuit with an active device and isolation structure interconnected through a diode circuit, and method of manufacture thereof

Semiconductor device structures and related fabrication methods are provided. An exemplary semiconductor device structure includes a body well region having a first conductivity type, a drift region and a source region each having a second conductivity type, where a channel portion of the body well region resides laterally between the source region and a first portion of the drift region that is adjacent to the channel portion. A gate structure overlies the channel portion and the adjacent portion of the drift region. A portion of the gate structure overlying the channel portion proximate the source region has the second conductivity type. Another portion of the gate structure that overlies the adjacent portion of the drift region has a different doping, and overlaps at least a portion of the channel portion, with the threshold voltage associated with the gate structure being influenced by the amount of overlap.

Semiconductor device and related fabrication methods

Embodiments of semiconductor devices and driver circuits include a semiconductor substrate having a first conductivity type, an isolation structure (including a sinker region and a buried layer), an active device within area of the substrate contained by the isolation structure, and a diode circuit. The buried layer is positioned below the top substrate surface, and has a second conductivity type. The sinker region extends between the top substrate surface and the buried layer, and has the second conductivity type. The active device includes a drain region of the second conductivity type, and the diode circuit is connected between the isolation structure and the drain region. The diode circuit may include one or more Schottky diodes and/or PN junction diodes. In further embodiments, the diode circuit may include one or more resistive networks in series and/or parallel with the Schottky and/or PN diode(s).

Semiconductor device and driver circuit with drain and isolation structure interconnected through a diode circuit, and method of manufacture thereof

Semiconductor device structures and related fabrication methods are provided. An exemplary fabrication method involves forming a layer of gate electrode material overlying a semiconductor substrate, forming a layer of masking material overlying the gate electrode material, and patterning the layer of masking material to define a channel region within a well region in the semiconductor substrate that underlies the gate electrode material. Prior to removing the patterned layer of masking material, the fabrication process etches the layer of gate electrode material to form a gate structure overlying the channel region using the patterned layer of masking material as an etch mask and forms extension regions in the well region using the patterned layer of masking material as an implant mask. Thereafter, the patterned layer of masking material is removed after forming the gate structure and the extension regions.

Semiconductor device including power and logic devices and related fabrication methods

A method for making a semiconductor structure includes forming an oxide layer onto non-volatile memory, high, and low voltage device regions of a substrate and forming a first gate material layer over the oxide layer. The first gate material layer is patterned to form a set of memory device select gates in the non-volatile memory device region and a set of gates in the high voltage device region. The patterning is performed while maintaining the oxide and first gate material layers over the low voltage device region. The method also includes forming a second gate material layer over the structure and forming a non-volatile storage layer between the set of select gates and the second gate material layer, from which a set of memory device control gates is patterned. Thereafter, the first gate material layer is patterned to form a set of gates in the low voltage device region.

Growing community of inventors

Chandler, AZ, United States of America

Richard J De Souza