Lam Research Corporation

Asyst Technologies, Inc.

Brooks Automation Gmbh

Crossing Automation, Inc.

Lam Research Ag

Aysts Technologies, Inc.

Asyai Technologies, Inc.

Brooks Automation US, LLC

Richard Howard Gould

Anthony C Bonora

Michael Krolak

John Edward Daugherty

Roger G Hine

David Trussell

Jerry A Speasl

Michael C Kellogg

Derek Witkowicki

Christopher J Pena

Klay Kunkel

Richard M Blank

Scott Vernon Wong

Alex Paterson

Damon Tyrone Genetti

Austin Ngo

Candi Kristoffersen

Marc Estoque

Christopher William Burkhart

Brandon L Senn

Martin Robert Maraschin

Bart Jan Van Schravendijk

William John Fosnight

Thorsten B Lill

Andreas Fischer

Daniel Babbs

Harald F Okorn-Schmidt

Ivan Berry

Mohsen Salek

James S Van Gogh

Benjamin W Mooring

Alexander Dulkin

Philipp Engesser

Efrain Quiles

Michael Nordin

John D Boniface

Michael Myslovaty

Michael D Brain

Robert R Netsch

Mark K Tan

Theodoros Panagopoulos

Peter R Wassei

Silvia Rocio Aguilar Amaya

Silvia Aguilar

Gustavo G Francken

Todd Anthony Lopes

David Adams

Edmundo Reyes

David Feindel

James Donald Keller

Timothy Luong

Steven Edmund Pracko

Jeffrey R Kerr

Hironobu Yasuumi

Anders Joel Bjork

A system comprises an equipment front end module (EFEM), a vacuum transfer module (VTM), a plurality off quad station process modules (QSMs). The EFEM is configured to receive a plurality of wafers. The EFEM comprises an EFEM transfer robot. The vacuum transfer module (VTM) is configured to receive the plurality of wafers from the EFEM. The VTM comprises a VTM transfer robot. The plurality of quad station process modules (QSMs) is coupled to the VTM. The VTM transfer robot is configured Oto transfer wafers between the VTM and the plurality of QSMs. The EFEM transfer robot is configured to transfer wafers between the EFEM and the VTM.

Reduced footprint wafer handling platform

A transfer robot assembly arranged within an ATV transfer module includes a transfer robot that includes an end effector and one or more arm segments connected between the end effector and a transfer robot platform. A first robot alignment arm is connected to the transfer robot platform. A second robot alignment arm is connected to the first robot alignment arm and to a mounting chassis of the ATV transfer module. The transfer robot assembly is configured to actuate the first robot alignment arm and the second robot alignment arm to raise and lower the transfer robot to adjust a position of the transfer robot in a vertical direction and in a horizontal direction. The transfer robot is configured to fold into a folded configuration having a narrow profile occupying less than 50% of an overall depth of the ATV transfer module.

Transfer robot for reduced footprint platform architecture

A substrate processing system configured to process substrates includes a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume and at least two process modules coupled to the substrate transport assembly. The substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume. At least two gas boxes are configured to deliver gas mixtures to the at least two process modules. An exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes. Surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.

Wafer transport assembly with integrated buffers

An atmosphere-to-vacuum (ATV) transfer module for a substrate processing tool includes a first side configured to interface with at least one loading station, a transfer robot assembly arranged within the ATV transfer module, and a second side opposite the first side. The transfer robot assembly is configured to transfer substrates between the at least one loading station and at least one load lock arranged between the ATV transfer module and a vacuum transfer module (VTM). The second side is configured to interface with the at least one load lock. The transfer robot assembly is arranged adjacent to the second side, and the at least one load lock extends through the second side into an interior volume of the ATV transfer module.

Reduced footprint platform architecture with linear vacuum transfer module

A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.

A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.

A storage system and methods for operating a storage system are disclosed. The storage system includes a plurality of storage shelves, and each of storage shelves has a shelf plate for supporting a container. Each of the storage shelves is coupled to a chain to enable horizontal movement and each is further coupled to a rail to enable guiding to one or more positions. A motor is coupled to a drive sprocket for moving the chain. The rail has some sections that are linear and some sections that are nonlinear. The sections are arranged in a loop. Example configurations of the storage system include one or more of stationary shelves, extended horizontal tracks for a hoist, a conveyor at a level of the storage system, and a manual loading station. The hoist, with an extended horizontal track interfaces with the manual loading station.

Integrated systems for interfacing with substrate container storage systems

Disclosed are methods and apparatuses for recirculating gas in an equipment front end module ('EFEM'), including the ability to provide a gas during recirculation and control the gas flow, pressure, and composition of the environment in the EFEM during recirculation.

Equipment front end module gas recirculation

A loading station for a substrate processing system includes first and second vertically-stacked loading stations. The first loading station includes a first airlock volume and first and second valves arranged at respective ends of the first loading station. The first and second valves are configured to selectively provide access to the first airlock volume and include first and second actuators, respectively, configured to open and close the first and second valves, and the first and second actuators extend downward from the first loading station. The second loading station includes a second airlock volume and third and fourth valves arranged at respective ends of the second loading station. The third and fourth valves are configured to selectively provide access to the second airlock volume and include third and fourth actuators, respectively, configured to open and close the third and fourth valves.

Platform architecture to improve system productivity

Systems and techniques for forming buffer gas microclimates around semiconductor wafers in environments external to a semiconductor processing chamber are disclosed. Such systems may include slot doors that may allow for single wafers to be removed from a multi-wafer stack while limiting outflow of buffer gas from a multi-wafer storage system, as well as buffer gas distributors that move in tandem with robot arms used to transport wafers for at least some of the movements of such robot arms.

Multi-station tool with wafer transfer microclimate systems

A system for mounting vacuum robot arms in horizontally elongate vacuum transfer modules is provided. The system provides mechanical isolation to the vacuum robot arm against deflections in the housing of the vacuum transfer module due to depressurization of the interior of the vacuum transfer module while the exterior of the vacuum transfer module is subjected to atmospheric pressure. Such systems may prevent undesirable, larger displacements of the end effector of such vacuum robot arms due to the deflection.

Vacuum robot positioning system with reduced sensitivity to chamber pressure

A load lock assembly includes a first load lock connected between an equipment front end module (EFEM) and a wafer transport module, the EFEM being at a lab ambient condition, the wafer transport module being at a vacuum condition, the wafer transport module being part of a wafer transport assembly that is configured to transport wafers to and from one or more process modules that are connected to the wafer transport assembly; a second load lock disposed over the first load lock, the second load lock connected between the EFEM and the wafer transport module; a post-processing module disposed over the second load lock, the post-processing module configured for performing a post-processing operation on a processed wafer that has been processed in at least one of the process modules that are connected to the wafer transport assembly, the post-processing module being configured for connection to the wafer transport module.

Load lock interface and integrated post-processing module

A buffer for use in semiconductor processing tools is disclosed. The buffer may be used to temporarily store wafers after processing operations are performed on those wafers. The buffer may include two side walls and a back wall interposed between the side walls. The side walls and the back wall may generally define an area within which the wafers may be stored in a stacked arrangement. Wafer support fins extending from the side walls and the back wall may extend into a wafer support region that overlaps with the edges of the wafers. Purge gas may be introduced in between each pair of wafers via purge gas ports located in one of the walls.

Buffer station with single exit-flow direction

An apparatus for processing wafer-shaped articles comprises a vacuum transfer module and an atmospheric transfer module. A first airlock interconnects the vacuum transfer module and the atmospheric transfer module. An atmospheric process module is connected to the atmospheric transfer module. A gas supply system is configured to supply gas separately and at different controlled flows to each of the atmospheric transfer module, the first airlock and the atmospheric process module, so as to cause: (i) a flow of gas from the first airlock to the atmospheric transfer module when the first airlock and the atmospheric transfer module are open to one another, and (ii) a flow of gas from the atmospheric transfer module to the atmospheric process module when the atmospheric transfer module and the atmospheric process module are open to one another.

Wet-dry integrated wafer processing system

An apparatus for transporting or storing at least one semiconductor wafer in an ultra-high vacuum is provided. A portable vacuum transfer pod is provided comprising an internal wafer storage chamber for storing one or more wafers and a wafer support for supporting at least one wafer within the internal wafer storage chamber. A passively capable vacuum pump capable of passive vacuum pumping is in fluid connection with the internal wafer storage chamber and is mechanically connected to the portable vacuum transfer pod. A shut off valve for opening and closing the fluid connection is between the passively capable vacuum pump and the internal wafer storage chamber.

Ultra-high vacuum transport and storage

Growing community of inventors

Fremont, CA, United States of America

Richard Howard Gould