Amp LLC

Richard Henry Zimmerman

Ronald A Dery

Myron Ceresa

Frederick R Deak

William S Scheingold

Albert Casciotti

John P Redmond

John R Rowlette

Jeff C Wu

Richard T Williams

Richard M Wagner

Gabriel B Cherian

Albert Shirk

Charles P Brooks

Elmer John Bottiglier

Frank N Vyas

An electrical connector (10,50,50',84,84') for being positioned between parallel surfaces and electrically interconnecting conductive areas on the surfaces is disclosed. More particularly, the connector (10,50,50',84,84') includes a housing (12,52,52',86) and contact elements (14,14',14',70,104) which are formed by wrapping a flexible, circuit carrying film (20,72) around a single canted coil spring (18) or by wrapping a flexible circuit carrying film (104) around two spaced apart canted coil springs (18).

Electrical connector for electrically interconnecting two parallel

Polymeric electrically conductive apparatus such as electric connectors are disclosed. These connectors employ a polymeric conductive material such as a conductive epoxy having conductive particles dispersed therein sufficient to establish electrical conductivity. These conductive materials are at least initially deformable such that electrical conductors may be inserted within an envelope containing the conductive material and electrical continuity for a prescribed circuit can be verified before structurally affixing the conductors to the envelope. Embodiments having radially collapsible envelopes for forming splice connectors and multicontact configurations employing rigid dielectric housings are disclosed.

Polymeric electrical interconnection apparatus and method of use

A method for the selective plating of a metal substrate on which a thin polymeric plating resist is first applied, followed by the selective removal of said resist to expose portions of said substrate to plating, and plating. More particularly, the method hereof includes the steps of selecting a laser wavelength which couples well to the metal substrate, choosing a polymer based plating resist having a low optical coefficient of absorption at said wavelength, curing said resist, subjecting selective areas of said resist to a single excimer laser shot, having a short wavelength, to cause ablative removal of the resist over the selective areas of said substrate, and subjecting said exposed portions of said substrate to metal plating.

Selective plating by laser ablation

An insulating sheath for preinsulated ferrule type electrical connectors having the sheath partially surrounding the ferrule is disclosed. The sheath is a two layer laminate comprised of a layer of heat resistant polyamide bonded to a layer of tetrafluoroethylene film. The polyamide layer is against the ferrule with the tetrafluoroethylene layer being the outside of the sheath. When the connector is crimped onto wires, the polyamide layer and connector are encased by the tetrafluoroethylene layer. The connector insulated with the laminate has a minimum Limiting Oxygen Index value of 28.

Flame retardant preinsulated electrical connector

The present invention relates to a device for electrically interconnecting two printed circuit boards or the like where the conductive pads are on extremely close spacing. More particularly, the invention includes a plurality of resilient connectors embedded in an elastomeric material with opposing ends thereof being exposed on opposite surfaces of the elastomeric body to provide contact points.

Electrical interconnecting device

Membrane switch assembly comprises a transparent laminate comprised of three sheets of cellulose acetate material. The intermediate sheet has an opening therein which defines a switch site. Hairline conductors on the internal surfaces of the outer sheets cross each other at the switch site so that the switch is closed when one of the outer sheets is pressed at the switch site. The conductors are produced on the surfaces of the outer sheets by a process including electroless deposition of blanket coatings of conductive metal, selective deposition along lines which define the conductors and selective etching of the blanket coating to leave the hairline conductors.

Optically clear membrane switch

A method is disclosed for forming complex shaped, metal-plastic composite lead frame structures for integrated circuit packaging. The lead frame pattern is formed on a metallic substrate having a profiled plastic member bonded thereto at such location as to hold the complexed shaped metal lead portions in a fixed spaced arrangement. The subject method results in substantial economies in reduced usage of plastics material and yet a high grade product having reliably positioned leads.

Method of forming complex shaped metal-plastic composite lead frames for

A method is disclosed for the generation of circuit patterns on a polyimide type of substrate by preconditioning the substrate's surface with a hydrazine/caustic solution, depositing a catalyst on the surface treated polymer, and exposing the polymer with the catalyst thereon to a bath having a metal therein capable of deposition electrolessly on the polymer surface containing catalyst.

Method of making sensitized polyimide polymers, having catalyst and

An improved conductor patterned substrate assembly is disclosed which permits direct attachment of integrated circuit chips to a metallized array while preventing stress buildup due to thermal cycling and/or bonding temperatures. A circuit is formed on a flexible substrate of insulative material which is suitable for withstanding solder, thermal compression bonding, or eutectic die attachment temperatures. The circuit includes a fine line pattern of leads extending up to the edge of a hole in the substrate substantially centered within the pattern of the integrated circuit pad dimensions. The subject assembly can thus be used face down bonding of integrated circuit chips which have bump metallization on the contact pads thereof. Thermal distortion of the substrate during bonding is minimized by the central hole thus preventing undue stresses from being applied to the chip bonds by the substrate. The assembly also provides for full support for the conductor leads throughout their entire length, in order to maintain dimensional and spacial stability especially for bonding larger multi-pad chips.

Conductor patterned substrate providing stress release during direct

The multiple interconnection module of the present invention is adapted to conductively interconnect the substantially aligned conductive terminals of a pair of circuit devices and consists of a wiring support body formed of a resilient material and a sheet of flexible material secured to the outer surface of the support body. The flexible sheet has a plurality of paired contacts formed thereon in predetermined positions, with wiring strips electrically connecting each pair of contacts. These contacts are exposed on the outer surface of the sheet for engagement with the conductive terminals of the circuit devices and the resilient support body biases the contacts into proper engagement with the conductive terminals.

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Palmyra, PA, United States of America

Richard Henry Zimmerman