Apple Inc.

Other

Richard H Tan

Jay S Nigen

William Francis Leggett

Brett W Degner

Bartley K Andre

Mikael M Silvanto

Matthew Phillip Casebolt

Ron Alan Hopkinson

Gavin J Reid

Eric Andrew Knopf

Frank Faqiu Liang

Houtan R Farahani

Eric J Weirshauser

Patrick Kessler

Charles A Schwalbach

James S Ismail

Derek Yap

Nagarajan Kalyanasundaram

David Tan

Palatan L Tan

Electronic device

Systems and methods are disclosed for determining a current machine state of a processing device, predicting a future processing task to be performed by the processing device at a future time, and predicting a list of intervening processing tasks to be performed by a first time (e.g. a current time) and the start of the future processing task. The future processing task has an associated initial state. A feed-forward thermal prediction model determines a predicted future machine state at the time for starting the future processing task. Heat mitigation processes can be applied in advance of the starting of the future processing task, to meet the future initial machine state for starting the future processing task.

Predictive control systems and methods

The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

Gaskets for thermal ducting around heat pipes

The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

Solid-state drive with passive heat transfer

The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.

Fasteners and dual-thickness thermal stages in electronic devices

Thermal device

A touring system is provided on a waste processing plant which includes a number of processing stations, including reception, sorting, mixing na pumping, fermentation, pressing, and refining. A housing is provided on each station. A passage is connected between every two adjacent housings. A transparent dome is provided in each housing so that people in the housing may observe a processing or a treatment of the waste without feel disgust and may realize how the waste is reusable.

Touring system for a waste processing plant

Growing community of inventors

Fremont, CA, United States of America

Richard H Tan