Machine Technology, Inc.

Other

Richard H Rubin

Gary Hillman

Scott M Pawenski

Richard C Heim

Benjamin J Petrone

Bernard H Paulfus

Lewis E Zarr

William K Hayes

A greeting bag is described that is includes a gift bag and a greeting card. The gift bag and greeting card connect together to form the integrated assembly of the greeting bag that has a purposefully coordinated single decorative style. The gift bag and greeting card have individual decors that define alternative aspects of that particular theme of a decorative style. An attachment mechanism can also be included in the greeting bag that further fixes the greeting card to the gift bag. The attachment mechanism can have a third decor as well as a size and dimensions that can include an image or sentiment. A method is described wherein a greeting bag is selected by selecting a gift bag from a set of one or more gift bags that share a common decorative style. A greeting card is selected from a set of one or more greeting cards that share the same common decorative style with the gift bag. The optional attachment mechanism is selected from a set of one or more attachment mechanisms that share the same common decorative style with the gift bag and greeting card. The gift bags, greeting cards and attachment mechanisms can be selectively mixed and matched from different sets within the decorative style.

Apparatus and method for a greeting bag

An apparatus and method achieves the submersiontype processing of silicon wafers in a manufacturing process for the fabrication of semiconductor devices therefrom. The silicon wafer is uniformly flooded with the process fluid in a manner which prevents impingement thereof during chemical processing, such as wet etching, cleaning, photoresist developing and the like. Upon flooding the silicon wafer, a gas pocket is formed between a portion of the lower surface of the wafer and an adjacent portion of vacuum chuck to which the wafer is mounted. The resulting gas pocket prevents accumulation of processed fluid therein to facilitate spin drying of the wafer.

Apparatus and method for the fluid treatment of a workpiece

A self-contained modular processing apparatus is disclosed for processing workpieces, and in particular, silicon wafers. The apparatus is constructed of framed modules which plug into a service facility docking subassembly and interlock therewith to make up a complete modular processing system for wafer processing. Each module may be provided with its own wafer transporting mechanism and includes a built-in CPU such that each module is an independent, stand-alone processing unit. Each processing unit, by being capable of independent operation, functions as a building block to configure a modular processing system capable of handling wafer flow in multiple directions while performing a multitude of processing functions or operations. Individual modules are arranged along a line of single fold symmetry such that a single transport mechanism may be employed for transferring wafers among adjacent modules.

Modular processing apparatus for processing semiconductor wafers

Methods and apparatus for transferring workpieces, such as silicon wafers, between a pair of cassettes involve simultaneously and conjointly indexing the cassettes such that the cassettes are incrementally lowered as the individual workpieces are removed from one cassette and delivered to the other cassette. Such indexing of the cassettes is achieved by a single elevator mechanism adapted to support both of the cassettes such that they are vertically and horizontally offset relative to each other.

Process apparatus and method and elevator mechanism for use in

A flexible workpiece transporter is provided with a guide roller adapted to move laterally with the flexible workpiece transporter to thereby inhibit chafing of the guide roller as a result of the lateral movement of the transporter relative to the guide roller. Chafing of the guide roller can be further inhibited by providing the guide roller with ends which are tapered so as to contact a relatively smooth upper surface of the transporter rather than a pair of relatively sharp longitudinal edges thereof.

Flexible workpiece transporter and roller assembly therefor

A vacuum processing apparatus and method utilize a vacuum chamber formed from a pair of casing sections, one of which is movable in to and out of sealing engagement with the other casing section. The movable casing section is equipped to carry a workpiece such that the workpiece is carried by the movable casing section as it moves into and out of sealing engagement with the other casing section and such that the workpiece is delivered to a processing station associated with the other casing section when the two casing sections are in sealing engagement with each other.

Growing community of inventors

West Paterson, NJ, United States of America

Richard H Rubin