Corning Incorporated

Corning Laser Technologies Gmbh

Innolas Systems Gmbh

Richard Grundmueller

Helmut Schillinger

Florian Spaeth

Frank Fabian Herrnberger

Michael Klein

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

Methods and apparatuses for laser processing materials

A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.

Method and device for the laser-based machining of sheet-like substrates

A method for laser-based machining of a flat substrate, to separate the substrate into a plurality of sections, in which the laser beam of a laser is directed at the substrate using an optical arrangement, which is positioned in the beam path of the laser. The optical arrangement forms a laser beam focal line that is extended as viewed along the beam direction and the substrate is positioned relative to the laser beam focal line such that an induced absorption is produced in the material of the substrate along a section of the laser beam focal line that is extended as viewed in the beam direction.

Method and device for laser-based machining of flat substrates

A structuring device is for structuring a plate-like element. A solar module and/or a thin-film solar module comprises a plurality of structuring tools which are configured respectively for introducing a track into the plate-like element, characterised by a first structuring unit which has a plurality of these structuring tools, at least two structuring tools of this first structuring unit being configured such that two first tracks which extend parallel to each other and at a constant spacing from each other can be introduced into the plate-like element with said structuring tools (first track group SG), and also a second structuring unit which has a plurality of these structuring tools, at least two structuring tools of this second structuring unit being configured such that two second tracks which extend parallel to each other and at a constant spacing from each other can be introduced into the plate-like element with said structuring tools (second track group SG), the first and/or the second structuring unit being configured and/or being able to be controlled such that the spacing of the first track group from the second track group can be configured variably.

Growing community of inventors

Lengenwang, Germany

Richard Grundmueller