International Business Machines Corporation

Richard Gerald Murphy

Voya Rista Markovich

John L Galvagni

Anthony P Ingraham

George J Saxenmeyer, Jr

Mark Vincent Pierson

George Frederick Walker

Anilkumar Chinuprasad Bhatt

Bahgat Ghaleb Sammakia

Jaynal Abedin Molla

Robert Douglas Edwards

Morris Anschel

Richard Stuart Zarr

Michael D Lowell

Scott D Reynolds

Timothy Shawn Reny

Paul Joseph Hart

Wayne R Storr

Charles Robert Lamb

Wolfgang Mayr

Leo Raymond Buda

Tamar A Powers

George John Saxenmeyer, Jr

Bette Jaye Whalen

A method of testing semiconductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip carrier is provided. The chip carrier has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into conductive contact with the conductor pads on the chip carrier. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing, the chip may be removed from the substrate. Alternatively, the chip may be bonded through the dendritic conductor pads to the substrate after successful testing.

Method and apparatus for in-situ testing of integrated circuit chips

A capacitor structure is described as having a plurality of dielectric materials located so that each dielectric material is in parallel between capacitor plates. The capacitor value of this structure is preset, therefore, for operation electrically at different specific temperatures. The description gives a specific stacked arrangement for the various dielectric materials in which this capacitor can be formed, as one example of that to which it is adaptable.

Method of manufacturing a decoupling capacitor structure

Decoupling capacitor structure

A method of testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip test fixture system is provided. The chip test fixture system has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into electrically conductive contact with the conductor pads on the chip test fixture system. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing the chip is removed from the substrate.

Method and apparatus for testing of integrated circuit chips

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Binghamton, NY, United States of America

Richard Gerald Murphy