Osram Opto Semiconductors Gmbh

Richard Floeter

Christian Schmid

Berthold Hahn

Korbinian Perzlmaier

Martin Strassburg

Markus Broell

Vincent Grolier

Kai Gehrke

Hans-Juergen Lugauer

Julia Grosser

A method for producing an optoelectronic semiconductor chip comprises the following steps: providing a substrate, depositing a sacrificial layer, depositing a functional semiconductor layer sequence, laterally patterning the functional semiconductor layer sequence, and oxidizing the sacrificial layer in a wet thermal oxidation process.

Method for producing an optoelectronic semiconductor chip

In at least one embodiment, the optoelectronic semiconductor chip comprises a semiconductor layer sequence for generating an electromagnetic radiation, and also a silver mirror. The silver mirror is arranged at the semiconductor layer sequence. Oxygen is admixed with the silver of the silver mirror. A proportion by weight of the oxygen in the silver mirror is preferably at least 10and furthermore preferably at most 10%.

Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip

A semiconductor body includes an n-conductive semiconductor layer and a p-conductive semiconductor layer. The p-conductive semiconductor layer contains a p-dopant and the n-conductive semiconductor layer an n-dopant and a further dopant.

Semiconductor body and method of producing a semiconductor body

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Tegernheim, Germany

Richard Floeter